Vacuum type chuck device having nitrogen protection
A vacuum chuck, nitrogen protection technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wafer backside contamination, wafer slippage, affecting production capacity and product quality, etc.
Inactive Publication Date: 2011-11-23
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
[0002] At present, in semiconductor production, many chemical liquids need to be applied during wafer surface treatment. In many cases, due to process requirements, the rotation speed of the wafer on the vacuum chuck is very low or it is directly stationary on the vacuum chuck. At this time It will cause the liquid to flow from the front of the wafer to the back of the wafer into the vacuum chuck, causing the wafer to slip, and will also cause contamination of the back of the wafer, affecting productivity and product quality
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[0018] Such as Figure 1-3 As shown, the vacuum chuck device with nitrogen protection of the present invention mainly includes: a vacuum chuck 1, a nitrogen protection cover 2 below the vacuum chuck, a motor 3 that drives the chuck to rotate, a wafer 4, and nitrogen injection holes 5, etc., a nitrogen protective cover 2 is provided under the vacuum chuck 1. The nitrogen protective cover 2 is an inverted and hollow bowl-shaped structure, and there is a circle of fine nitrogen injection holes 5 in the bowl-shaped structure. At this time, the vacuum chuck 1 clamps the wafer 4, and the vacuum chuck 1 drives the wafer 4 to rotate; at the same time, on the side of the vacuum chuck 1 on the back of the wafer 4, the nitrogen gas is ejected through the nitrogen injection hole of the inverted bowl-shaped structure. To protect the contact part of the vacuum chuck 1 and the wafer 4, to protect the back of the wafer and the chuck, and at the same time, the nitrogen protective cover will al...
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The invention relates to the semiconductor field, more particularly to a vacuum type chuck device having nitrogen protection, wherein the device is used in the semiconductor production. During the wafer processing process, lots of chemicals or chemical liquid are needed to be applied on the surface of the wafer, so that the backside of the wafer and a vacuum chuck device of the wafer can be protected. The device is provided with a vacuum chuck and a nitrogen protective cover that is arranged below the vacuum chuck. The nitrogen protective cover, which is arranged below the vacuum chuck, has a reversed and hollow-out structure in a bowl shape. Nitrogen orifices are in the bowl-shaped structure. When a semiconductor is being produced, a wafer is stuck by the vacuum chuck and the vacuum chuck drives the wafer to make a rotation. Simultaneously, nitrogen is sprayed out at one side of the vacuum chuck and at the back side of the wafer and is sprayed out by the nitrogen orifices of the reversed bowl-shaped structure, so that the contacted part by the vacuum chuck and the wafer is protected. According to the invention, when a wafer is rotated at a low speed or still, the backside of the wafer can be protected by nitrogen, so that liquid of chemicals can be prevented from entering a vacuum chuck.
Description
technical field [0001] The invention relates to the field of semiconductors, specifically a vacuum chuck device with nitrogen protection used in semiconductor production. During the wafer processing process, many chemicals or liquids need to be applied on the wafer surface to protect the The role of wafer backside and wafer vacuum chuck systems. Background technique [0002] At present, in semiconductor production, many chemical liquids need to be applied during wafer surface treatment. In many cases, due to process requirements, the rotation speed of the wafer on the vacuum chuck is very low or it is directly stationary on the vacuum chuck. At this time It will cause the liquid to flow from the front of the wafer to the back of the wafer into the vacuum chuck, causing the wafer to slip, and will also cause contamination of the back of the wafer, affecting productivity and product quality. Contents of the invention [0003] In order to overcome the above-mentioned deficie...
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IPC IPC(8): H01L21/687
Inventor 王阳
Owner SHENYANG KINGSEMI CO LTD