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Test Fixture

A technology of test fixtures and test needles, which is applied in the direction of the measuring device shell, etc., can solve the problems of increasing test costs, reducing test efficiency, affecting contact, etc., and achieves the effects of ensuring contact stability, improving test efficiency, and reducing mistesting

Active Publication Date: 2011-12-21
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the existing test fixture to test the printed circuit board processed by the OSP process, the protective film on the surface of the printed circuit board is difficult to be pierced by the test needle, which affects the contact between the test needle and the test point on the printed circuit board , causing this kind of printed circuit board processed by the OSP process to have more mistesting problems during the online test (In-Circuit Test, ICT) or functional test (Functional Circuit Test, FCT), which reduces the test efficiency. Increased cost of testing

Method used

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] Embodiments of the present invention provide a test fixture, such as figure 1 As shown, the test fixture includes:

[0018] The primary contact device includes: a carrier plate 1 arranged under the primary contact device, a test pin 6 located under the carrier plate 1, and the primary contact device presses down and presses the board to be tested on the carrier plate 1 to contact the test pin 6, once The contact device includes: a pressing plate 2, the lowe...

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PUM

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Abstract

The embodiment of the invention discloses a test fixture, and relates to the technical field of testing of printed circuit boards. The test fixture reduces misdetection and improves the test efficiency in the process of testing a printed circuit board, and comprises a primary contact device, a carrier plate arranged under the primary contact device, a test needle positioned under the carrier plate and a secondary contact device; the primary contact device downwards presses a board to be tested on the carrier plate to contact the test needle; the secondary contact device is arranged under the carrier plate and connected with the primary contact device; and in the process of downwards pressing the primary contact device, after the board to be tested is contacted with the test needle, the secondary contact device drives the test needle to be separated from the board to be tested, and afterwards drives the test needle to be contacted with the board to be tested again.

Description

technical field [0001] The invention relates to the technical field of printed circuit board testing, in particular to a testing fixture. Background technique [0002] Printed circuit boards need to go through many links in the production process, and each link needs corresponding testing instruments to detect whether the product is good or bad. The test fixture is a platform for testing printed circuit boards. Its working principle is to use test needles to connect the points to be tested on the printed circuit board with the corresponding points in the test machine, and then the test machine can realize the test of the printed circuit board by calling the corresponding program. Circuit board testing. [0003] At present, the printed circuit board has completely adopted the lead-free treatment process, that is, the surface of the printed circuit board is treated with the Organic Solderability Preservatives (OSP) process, and a protective film will be formed on the printed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
Inventor 颜禄兴郭钜添
Owner HUAWEI DEVICE CO LTD
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