A wafer position detection device

Abstract

A wafer position detection device, comprising a pusher and a wafer box placed on the pusher, the wafer box has a first side for taking and placing wafers and a second side opposite to the first side side; the wafer position calibration device also includes a detection sensor, the detection sensor is composed of two parts, a signal transmitter and a signal receiver, and the signal transmitter and the signal receiver are respectively located on the wafer box two ends, and the connection line between the signal transmitter and the signal receiver is infinitely close to the edge side of the second side. The wafer position detecting device of the present invention adds detection sensors to judge in real time whether the edge of the wafer in the wafer avoiding wafer box collides with the edge of the second side of the wafer box, thereby avoiding damage to the wafer due to impact and improving the safety of the wafer. Production yield and save production cost.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer position detection device. Background technique [0002] Standard Mechanical Interface (SMIF, Standard Mechanical Interface) technology is centered on the concept of "isolation technology". Isolation technology refers to preventing product contamination by enclosing wafers in an ultra-clean environment while relaxing the cleanliness requirements outside this enclosed environment. The SMIF consists of three parts, which are used to close the container for storing and transporting boxed semiconductor wafers during the manufacturing process, that is, the standard mechanical interface wafer box (SMIF-Pod); the input and output devices used to open the SMIF-Pod, that is, the loading ports; and ultra-clean enclosed small environments with loadport integration through process systems. The operator manually delivers the SMIF-Pod to the loadport; the loadport automaticall...

AI Technical Summary

Problems solved by technology

This design solves the problem of avoiding the collision between the edge of the wafer and the edge of the second side of the open wafer cassette when the mechanical arm drives the manipulator into the open wafer cassette and before the wafers in the open wafer cassette are loaded out However, in actual operation, the process of pushing and aligning requires manual operation by the operator, and the operator easily forgets to push the wafer placed in the open cassette. Therefore, it is still often caused by the edge of the wafer Wafer damage due to side impact with open cassette second side edge

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