Device for plating nickel and gold on crystal grains

Abstract

The invention discloses a device for plating nickel and gold on crystal grains, relates to a nickel and gold plating device for re-plating defective products, and provides a device for plating nickel and gold on crystal grains, which ensures that each crystal grain can be uniformly and fully contacted with a plating solution. The device comprises a plating tank and a basket with a handle; crystal grains are put inwards from the highest end of a bottom plate 2 in the plating tank one by one, and move downwards along the bottom plate 2 under the action of gravity; the bottom plate 2 is provided with a plurality of holes, nitrogen is sprayed from the holes, bubbles are formed, and the crystal grains are prevented from directly contacting and rubbing the bottom plate 2; and the crystal grains sliding to the lowest end of the bottom plate 2 finally fall into the basket, and taken out of the plating tank to complete a nickel and gold plating procedure. The labor intensity is reduced, the processing efficiency is improved, the plating solution is prevented from splashing onto a body when the basket is shaken due to manual operation, and the vapor of the plating solution is prevented from being directly sucked; and because the crystal grains are added one by one and move in a suspended way in the moving process, the crystal grains can be fully contacted with the plating solution and prevented from rubbing with the bottom plate 2.

Description

technical field [0001] The invention relates to a nickel-gold-plated device for semiconductor crystal grains, in particular to a nickel-gold-plated device for reworking defective products. technical background [0002] In the semiconductor manufacturing process, poor welding sometimes occurs during the welding process of diode grains, such as gold layer peeling off, nickel layer peeling off (commonly known as Ni-peeling), etc. The poor welding effect directly affects the application of the die on the client side , has a large quality hidden danger. [0003] The reason is: the semiconductor wafer has uneven coating before cutting, and this phenomenon is not easy to be found in many cases. Only when the wafer is cut into grains and the tensile test is done on the welded parts after welding can the relevant situation of coating peeling be found. The rework of the chip is relatively easy, just remove the gold and then re-plate nickel and gold according to the original process. ...

AI Technical Summary

Problems solved by technology

However, due to the rework of the grains, the grains are small and the grains are easy to pile up during operation.

At present, the conventional method is to place the grains in the basket, and then manually immerse them into the plating tank. Even if the basket can be fully shaken during manual operation, it is difficult to ensure that each part of each grain is in full contact with the plating solution.

The fundamental reason is that the grains are small and easy to pile up together during operation. The solution can only fully react with some grains on the surface, and the grains accumulated in the interior react less, and the color of the plated grains generally varies greatly.

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