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Printed circuit board

By designing the relationship between the line width of the differential signal line and the line spacing on the printed circuit board, keeping the impedance unchanged, solving the impedance mismatch problem caused by the change of the line spacing of the differential signal line on the printed circuit board, ensuring the integrity of signal transmission. .

Inactive Publication Date: 2012-01-25
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the impedance of the differential signal line is related to the line width and line spacing of the differential signal line, when the line spacing of the differential signal changes, the impedance of the differential signal line also changes accordingly, resulting in an impedance mismatch of the differential signal line, which in turn affects the differential signal line. Integrity of the signal transmitted on the signal line

Method used

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Embodiment Construction

[0021] Please refer to figure 1 and image 3 , The first preferred embodiment of the printed circuit board 10 of the present invention includes a signal layer 120 , an insulating layer 160 and a reference layer 180 . The signal layer 120 is provided with a pair of differential signal lines 122 and 126 for transmitting differential signals. The insulating layer 160 is disposed between the signal layer 120 and the reference layer 180 for isolating the signal layer 120 from the reference layer 180 . The reference layer 180 is a power layer or a ground layer or a power ground layer.

[0022] In this embodiment, the differential signal lines 122 and 126 are both microstrip lines, and the thicknesses of the differential signal lines 122 and 126 are both T, and the initial line widths are both W 0 , the initial line spacing is S 0 . The insulating layer 160 is made of a dielectric material with a dielectric constant ε and a thickness H. When the differential signal lines 122, 1...

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Abstract

The invention provides a printed circuit board. The printed circuit board comprises a signal layer with a pair of differential signal wires, wherein the wire width W of the differential signal wires changes along with change of the wire spacing S of the differential signal wires according to the relationship in an equation to maintain constant impedance of the differential signal wires, so that completeness of transmission signals on the differential signal wires is ensured.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] When the differential signal lines on the printed circuit board are connected to connection points with irregular structures such as pads and gold fingers, or when the hollowed out areas on the printed circuit board are to be bypassed, the spacing of the differential signal lines will change. Since the impedance of the differential signal line is related to the line width and line spacing of the differential signal line, when the line spacing of the differential signal changes, the impedance of the differential signal line also changes, resulting in an impedance mismatch of the differential signal line, which in turn affects the differential signal line. The integrity of the signal transmitted on the signal line. Contents of the invention [0003] In view of the above, it is necessary to provide a printed circuit board capable of maintaining the impedance of the differen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K2201/09727H05K1/0245
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD