Wafer fixing device and using method thereof
A technology for fixing wafers and components, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as wafer damage and achieve the effect of ensuring operation safety
Active Publication Date: 2012-02-01
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to provide a wafer holding device and its use method to solve the problem that damage to the wafer due to the failure of other pushing elements cannot be avoided only by detecting one pushing element in the wafer holding device
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[0020] A wafer fixing device and its usage method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in very simplified form and use imprecise ratios, which are only used for the purpose of conveniently and clearly assisting in describing the embodiments of the present invention.
[0021] The core idea of the present invention is to provide a wafer fixing device, in which a monitoring element is provided on each pushing element to ensure that each pushing element and the clamp corresponding to each pushing element can be monitored in real time whether it is working normally, so as to ensure that each All the fixtures can hold the wafer normally. The invention also provides a method for using the wafer fixing device. After a plu...
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The invention provides a wafer fixing device, which comprises a plurality of driving elements and a plurality of clamps controlled by the driving elements respectively. The wafer fixing device also comprises monitoring elements which are arranged on the plurality of driving elements respectively and are connected with one another through signals, wherein each monitoring element is connected with a signal control analyzer. The invention also provides a using method for using the wafer fixing device. The using method comprises the following steps of: reading position movement information of the driving elements respectively by the plurality of monitoring elements; transmitting the position movement information to the signal control analyzer; judging whether the position movement information of each driving element is normal or not by the signal control analyzer; and checking the wafer fixing device if the position movement information is abnormal. By the wafer fixing device provided by the invention, each driving element is provided with the monitoring element to monitor whether each driving element and the clamp corresponding to each driving element work normally or not in real time so as to ensure that each clamp can normally clamp a wafer.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing technology, in particular to a wafer fixing device and a using method thereof. Background technique [0002] Manufacturing semiconductor components with tiny structures requires highly precise technology. During the manufacturing process, the wafer is placed on the carrier table. When performing different processes on the wafer, the wafer needs to be fixed, and the wafer needs to be taken out after the process is completed. If there is a deviation when the wafer is fixed or taken out , it is easy to cause damage to the wafer, so it is very important to detect the fixed state of the wafer. figure 1 It is a schematic cross-sectional structure diagram of a wafer fixing device in the prior art. refer to figure 1 , the wafer fixture includes a plurality of pushing elements 11, a plurality of pushing elements 11 are fixed in the base plate 16, and a plurality of pushing plate...
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IPC IPC(8): H01L21/683
Inventor 陈超包中诚华俊杰
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP