Pin-forming mold for integrated circuits

Abstract

The invention belongs to the field of press-forming integrated circuits and particularly relates to a pin-forming mold for DIP (Dual Inline Package) / IDF (Intermediate Distributing Frame) package integrated circuits. The mold comprises a fixing device which is used for holding down a product to be formed and pins of the product; conjugate roller wheel devices which are used for enabling pins to be formed are respectively arranged at two sides of the fixing device; and a taper wedge device which is used for guiding the conjugate roller wheel device to work is arranged at one side of each of the conjugate roller wheel devices far away from the fixing device. The mold is made from a pair of conjugate roller wheels, i.e. main roller wheels and auxiliary roller wheels, which can swing; when the pins are formed, the main roller wheels and the auxiliary roller wheels generate conjugate movement, i.e. the main roller wheels and the auxiliary roller wheels mutually rotate in opposite directions so as to ensure that the pins of the product are formed by means of pure rolling, thus the quality of the product can be greatly improved; and meanwhile, the phenomenon of clamping stagnation generated between a mandrel and roller wheels in a single-roller wheel forming manner can be avoided.

Description

technical field [0001] The invention belongs to the field of integrated circuit pressing and molding, and in particular relates to a lead molding die for integrated circuits packaged in DIP / IDF type. Background technique [0002] DIP packaging, also known as dual in-line packaging technology, English is Dual In-line Package, is the simplest packaging method, and most small and medium-sized integrated circuits (ICs) use this packaging form. The traditional and more general DIP package lead forming method is rigid forming method or single roller forming method. Initially, the rigid forming method was adopted in the industry. The structure of the rigid forming method is simple, and the forming punch and die are fixed. Since the rigid forming method uses the punch to slide on the surface of the pin to form the pin, It will inevitably lead to scratches on the tin-plated layer on the surface of the pins, especially after long-term use, due to the accumulation of tin layer on the ...

AI Technical Summary

Problems solved by technology

However, the single-roller forming method is still not a pure rolling friction method, especially the mandrel and the roller will be stuck after a long period of use, and the roller cannot roll when it is stuck, so it will return to sliding friction forming

Moreover, the single-roller forming is the same as the rigid forming, the forming punch and die are fixed, and it is very troublesome to adjust the forming size

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