Method for producing circuit board containing stepped blind hole

A manufacturing method and circuit board technology, which are applied in the direction of electrical connection formation of printed components, etc., can solve problems such as difficulty in liquid medicine exchange, quality problems of blind holes, failures, etc., and achieve the effect of avoiding blind hole opening and blind hole blackening.

Inactive Publication Date: 2012-02-08
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When performing surface treatment, when the depth of the blind hole exceeds a certain value, it will become difficult to exchange the liquid in the hole, especially when the hole depth divided by the

Method used

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  • Method for producing circuit board containing stepped blind hole
  • Method for producing circuit board containing stepped blind hole
  • Method for producing circuit board containing stepped blind hole

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Experimental program
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Embodiment Construction

[0017] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.

[0018] Such as figure 1 As shown, the specific embodiment of the present invention is: build a kind of circuit board that contains blind hole, comprise blind hole, described blind hole is stepped hole, and blind hole top 1 is cylindrical hole, and blind hole bottom 2 is tapered hole , the tapered hole is an inverted cone, and the tapered portion of the tapered hole is the lower end of the blind hole. The specific implementation process of the present invention is: when making the circuit board containing blind holes, make the blind holes into a stepped hole shape, that is, the upper part 1 of the blind hole is a cylindrical hole with a large aperture, and the lower part 2 of the blind hole is a tapered hole. The aperture is small. When the technical solution of the present invention is used for electroplating and nickel-gold surface treatment, t...

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PUM

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Abstract

The invention relates to a method for producing a circuit board containing a blind hole, comprising the following steps of: producing a blind hole which is a cylindrical hole at the upper part and a tapered hole at the lower part; depositing copper, electroplating and producing a pattern on the circuit board; producing a solder mask on the surface of the circuit board without covering ink or plugging on the blind hole; performing surface treatment on the circuit board; and plugging the blind hole by solder resist or covering ink. According to the technical scheme of the invention, when electroplating and nickel and gold deposition surface treatment are performed, the added tapered hole changes the original blind hole on one side into a through hole big at one end and small at the other end, entrapped air can not exist in the hole, and liquid medicine can flow and exchange easily in the hole, thereby effectively solving the problems of blind hole open circuit and blind hole blackening because liquid can not flow and exchange originally.

Description

technical field [0001] The invention relates to a circuit board containing blind holes and a manufacturing method thereof, in particular to a circuit board containing stepped blind holes and a manufacturing method thereof. Background technique [0002] With the development of circuit board technology, circuit boards containing blind vias are widely used. For circuit boards containing blind holes, when making circuit boards containing blind holes, it is necessary to perform electroplating and surface treatment on the circuit boards. When performing surface treatment, when the depth of the blind hole exceeds a certain value, it will become difficult to exchange the liquid in the hole, especially when the hole depth divided by the hole diameter value is greater than 1:1, such problems are more likely to occur, electroplating and surface treatment When it is used, it will cause quality problems in the blind hole and cause failure. Contents of the invention [0003] The t...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB
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