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Flip chip packaging structure

A packaging structure and flip-chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of short service life of chips, and achieve the effects of prolonging service life, simple production process and low cost

Inactive Publication Date: 2012-02-29
CHANGSHU HUAHAI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide a flip-chip packaging structure, which can solve the problem of short service life of traditional chips

Method used

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  • Flip chip packaging structure
  • Flip chip packaging structure

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Embodiment Construction

[0011] Such as figure 1 As shown, a flip-chip packaging structure according to the present invention includes a substrate strip, a chip, and a cover plate. The substrate strip is provided with a number of mounting holes, and the positive and negative electrodes of the chip are mounted and fixed on the substrate through the mounting holes. On the substrate strip, the cover plate is installed above the chip and leaves a gap with the substrate strip, and the cover plate body is provided with an opening and an air extraction hole.

[0012] The substrate strips, chips and cover plates are sealed by colloid.

[0013] The substrate strip and the cover plate adopt a one-piece structure of high-temperature injection molding.

[0014] The outermost layer of the chip is sealed with waterproof resin.

[0015] The beneficial effect of the present invention is that: the special flip-chip structure design is adopted, which overcomes the shortcomings of the traditional chip packaging struct...

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Abstract

The invention discloses a flip chip packaging structure. The structure comprises: a substrate strip, a chip and a cover plate. The substrate strip is provided with several installing holes. Positive and negative electrodes of the chip are installed and fixed on the substrate strip through the installing holes. The cover plate is installed above the chip and a gap is arranged between the cover plate and the substrate strip. A special flip structure design is adopted. Disadvantages of the traditional chip packaging structure can be overcome. A service life of the chip which employs the structure of the invention can be prolonged. A production technology is simple and costs are low. The structure deserves a large scale market promotion.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a flip chip packaging structure. Background technique [0002] The chip that people usually refer to is IC, which generally refers to all electronic components, and is a circuit module that integrates various electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, undertaking the functions of computing and storage. The application range of integrated circuits covers almost all electronic equipment for military and civilian use. [0003] Patent application No. 200910003642 discloses a flip-chip packaging method, which at least includes the following steps: first, providing a substrate strip containing at least one substrate unit; then, disposing at least one chip on the substrate unit , the chip is electrically connected to the substrate unit; then, a template is set on an upper surface of the substrate strip, ...

Claims

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Application Information

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IPC IPC(8): H01L23/28H01L23/31
Inventor 徐轶群
Owner CHANGSHU HUAHAI ELECTRONICS
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