Image sensing module and camera module

Abstract

The invention relates to an image sensing module which comprises a bearing substrate, an image sensor and a plurality of wires, wherein the bearing substrate is provided with a top surface, a bottom surface, light holes and a plurality of conductive pads arranged on the top surface; the image sensor is provided with a first surface and a plurality of solder pads arranged on the first surface; the first surface comprises a sensing area and a peripheral area; the solder pads are arranged at the peripheral area; the first surface of the image sensor is opposite to the bottom surface of the bearing substrate, and the peripheral area of the first surface is fixed at the bottom surface; and the wires pass through the light holes and then are used for respectively electrically connecting the solder pads with the conductive pads on the bearing substrate in one-to-one correspondence. The invention also relates to a camera module with the image sensing module.

Description

technical field [0001] The invention relates to an image sensing module and a camera module with the image sensing module. Background technique [0002] With the development of science and technology, electronic devices such as miniaturized digital cameras, mobile phones or notebook computers are getting closer to people's lives. In order to meet people's needs, camera modules installed in electronic devices are becoming smaller and smaller. [0003] A common camera module generally includes a mirror holder containing lenses and an image sensing module connected to the mirror holder. The image sensing module includes a circuit board and an image sensor arranged on the circuit board. The circuit board has a groove and a plurality of conductive pads arranged on the bottom surface of the groove. The groove is used for accommodating the image sensor. The plurality of conductive pads are sandwiched between the image sensor and the groove. The image sensor is disposed on the ...

AI Technical Summary

Problems solved by technology

When some conductive pads are low, these conductive pads cannot form good electrical contact with the corresponding pads, so that there is an open circuit between the image sensor and the circuit board; when some conductive pads When the height is high, the conductive pads press the corresponding pads, so that two adjacent pads are in contact, which directly causes a short circuit on the circuit between the image sensor and the circuit board.

In addition, during high-temperature, high-humidity and cold-heat cycle tests, the conductive pad is not easy to withstand the stress of expansion and contraction between the image sensor and the circuit board, resulting in delamination between the conductive pad and the solder pad, which directly affects The electrical connection between the image sensor and the circuit board

In addition, the image sensor is accommodated in the groove, and the heat dissipation efficiency is also low, resulting in poor imaging effect of the camera module with the image sensor module

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