Image sensor module and camera module

Abstract

The invention relates to an image sensing module, which includes a carrier substrate, an image sensor and a plurality of wires. The carrying substrate has a top surface, a bottom surface, a light hole passing through the top surface and the bottom surface, and a plurality of conductive pads arranged on the top surface. The image sensor has a first surface and a plurality of welding pads arranged on the first surface. The first surface includes a sensing area opposite to the light hole and a peripheral area surrounding the sensing area. The plurality of welding pads are disposed on the peripheral area. The carrier substrate also includes a plurality of accommodating holes passing through the top surface and the bottom surface and distributed at intervals. The plurality of receiving holes surround the light hole. The first surface of the image sensor is opposite to the bottom surface of the carrier substrate and fixed on the bottom surface. The plurality of wires pass through the plurality of receiving holes and respectively electrically connect the plurality of welding pads with the plurality of conductive pads on the carrier substrate in one-to-one correspondence. The invention also includes a camera module with the image sensing module.

Description

technical field [0001] The invention relates to an image sensing module and a camera module with the image sensing module. Background technique [0002] With the development of science and technology, electronic devices such as miniaturized digital cameras, mobile phones or notebook computers are getting closer to people's lives. In order to meet people's needs, camera modules installed in electronic devices are becoming smaller and smaller. [0003] Existing camera modules generally include a mirror holder containing lenses and an image sensing module connected to the mirror holder. The image sensing module includes a circuit board and an image sensor arranged on the circuit board. The circuit board has a groove and a plurality of conductive pads arranged on the bottom surface of the groove. The groove is used for accommodating the image sensor. The plurality of conductive pads are sandwiched between the image sensor and the groove. The image sensor is disposed on the ...

AI Technical Summary

Problems solved by technology

When some conductive pads are low, these conductive pads cannot form good electrical contact with the corresponding pads, so that there is an open circuit between the image sensor and the circuit board; when some conductive pads When the height is high, the conductive pads press the corresponding pads, so that two adjacent pads are in contact, which directly causes a short circuit on the circuit between the image sensor and the circuit board.

In addition, during high temperature, high humidity and thermal cycle tests, the conductive pad is not easy to withstand the expansion and contraction stress of the image sensor and the circuit board, resulting in delamination between the conductive pad and the solder pad, which directly affects the image perception. The electrical connection between the tester and the circuit board

In addition, the image sensor is accommodated in the groove, and the heat dissipation efficiency is also low, resulting in poor imaging effect of the camera module with the image sensor module

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