Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy resin composite

A technology of epoxy resin and composition, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve problems such as failure to achieve reliability, and achieve the effect of high permeability

Active Publication Date: 2013-05-08
THREEBOND FINE CHEM CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is similar to the use of underfill in the point of flowing into the gap, but it does not meet the requirements of reliability in the application of mounting electrodes that remain connected.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~12

[0042] In order to prepare Examples 1-12, the following components were prepared.

[0043] (A) Component: epoxy resin composition

[0044] ・Bisphenol F type epoxy resin (jER806 manufactured by Japan Epoxy Resin Co., Ltd.)

[0045] (B) Component: A compound having three or more epoxy groups and an aromatic ring in a single molecule

[0046] ・A compound having three or more epoxy groups and an aromatic ring in a single molecule (jER630 manufactured by Japan Epoxy Resin Co., Ltd.)

[0047] ・Compounds having 3 or more epoxy groups and aromatic rings in a single molecule (ELM-100 manufactured by Sumitomo Chemical Co., Ltd.)

[0048] (C) Composition: Butadiene rubber powder or acrylic rubber powder

[0049] ・Butadiene rubber powder dispersed in epoxy resin (rubber content: 25% by mass) (Kane AceMX136 manufactured by Kaneka Co., Ltd.)

[0050] ・Acrylic rubber powder (ZEFIAC F351 manufactured by Zeon Co., Ltd., Japan)

[0051] ・Acrylic rubber powder (GENIOPERL P-52 manufactured b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
storage modulusaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

Provided is a capillary flow underfill sealing material that holds up well in reliability tests, is highly permeable both in room-temperature air (25°C) and 120°C air, and is an epoxy resin composite that fulfills each of the following conditions: linear expansion coefficient when cured (a1) of 60 ppm / °C or less; glass transition point at least 120°C; storage elastic modulus at 25°C of 3.0 GPa or less; and permeability at 120°C of at least 30 mm.

Description

[0001] technology area [0002] The present invention relates to a method of sealing with a resin composition after connecting solder balls to substrate electrodes, suitable for chip size packaging (CSP), ball contact array (BGA), wafer level chip size packaging (WL-CSP), etc. Post-wet sealant epoxy resin composition. Background technique [0003] Conventionally, a sealing method has been used in which solder balls are connected to substrate electrodes by the self-alignment effect of solder during substrate mounting, and after a cleaning process, a curable resin composition is injected into the gap and cured. Such encapsulants are commonly referred to as underfills and are actually epoxy resins. On the other hand, there is also known a polyurethane resin underfill as disclosed in JP-A-2003-504893. In the case of polyurethane resin, since it is characterized by its repairability, reliability may be low. [0004] On the other hand, there is a method of improving reliability b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L51/04H01L23/29H01L23/31
CPCC08G59/3218C08L63/00H01L21/563C08L9/06H01L23/295H01L2924/0002C08L2666/22C08L2666/14H01L2924/00C08K5/1515C08L51/04H01L23/29
Inventor 久保山俊史
Owner THREEBOND FINE CHEM CO LTD