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Optical device and method of producing the same

A technology for optical devices and light-emitting elements, applied in the field of optical devices, can solve problems such as defective appearance, dust adhesion, etc., and achieve the effect of effective manufacturing

Inactive Publication Date: 2012-03-21
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem here is that the surface of the resulting cured silicone material is rather sticky, which leads to adhesion of grime and thus a defective appearance

Method used

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  • Optical device and method of producing the same
  • Optical device and method of producing the same
  • Optical device and method of producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0045] The optical device of the present invention and the method of the present invention for manufacturing the optical device are described in detail by way of examples. The viscosities in the examples are values ​​at 25°C.

[0046] [Practical example 1]

[0047] A FFT 1005 from TOWA was used as a compression molding machine. An alumina circuit substrate on which 256 light emitting diode (LED) chips were mounted was fixed in an upper mold of the press molding machine using clips. Then, methylhydrogenpolysiloxane, which has a viscosity of 20 mPa·s and a silicon-bonded hydrogen content of 1.56% by weight, is capped with trimethylsiloxy at both ends of the molecule at 0.05 g / m 2 The coating rate coated 0.05mm thick polyolefin resin film is introduced into a film with such as figure 2 The mold with the concave cavity shown is placed on the mold, and the film is in close contact with the lower mold through the suction mechanism stored in the lower mold. Then 1.5 g of a hydro...

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Abstract

An optical device of the present invention comprises a light-emitting element or a light-receiving element mounted on a support and a cured silicone material unified into a single article onto the support by the sealing of the element with a hydrosilylation reaction curable silicone composition, and is characterized in that the surface of the cured silicone material has been treated with an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule. The optical device is resistant to the adherence of dust and dirt due to an inhibition of the stickiness of the surface of a cured silicone material that seals a light-emitting element or a light-receiving element mounted on a support and has thereby been unified into a single body onto the support.

Description

technical field [0001] The present invention relates to an optical device in which a cured silicone material is integrated with a light-emitting element or a light-receiving element mounted on a holder into a single article. The invention further relates to a method of manufacturing the optical device. Background technique [0002] It is known to provide optical devices by encapsulating light-emitting elements (for example LED chips) mounted on a support with a curable silicone composition to obtain the integration of the support and the cured silicone material into a single article. In an example of a method for manufacturing the optical device, a mold with a cavity opposite to the location of the LED chip mounted on the holder is coated with a very thin release film; the curable silicone composition is then filled with and then press the bracket carrying the LED chip against the mold and cure the composition (refer to Japanese Unexamined Patent Application Publication Nos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D183/04H01L33/56H01L33/54H01L23/29B29C33/68
CPCB29L2011/00B29C39/10B29C39/006C08G77/12C08L83/04B29K2083/005B29C33/68H01L33/56H01L24/97H01L2224/48091H01L2224/45144H01L2924/12041H01L2924/15787H01L2924/181H01L2924/00014H01L2924/00C08J7/0427H01L2924/1579H01L2924/186C08J2483/04
Inventor 寺田匡庆
Owner DOW CORNING TORAY CO LTD