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Manufacturing method of multilayer flexible printed wiring board

A manufacturing method and a flexible printing technology are applied in the directions of multi-layer circuit manufacturing, printed circuit manufacturing, and simultaneous processing of multiple printed circuits. The effect of stability and reliability

Active Publication Date: 2015-12-09
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of these documents is aimed at the stepped via structure, and does not disclose the problem of the decrease in alignment accuracy due to the expansion and contraction of the flexible base material when forming a small-diameter stepped via hole and a solution to it.

Method used

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  • Manufacturing method of multilayer flexible printed wiring board
  • Manufacturing method of multilayer flexible printed wiring board
  • Manufacturing method of multilayer flexible printed wiring board

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Embodiment Construction

[0044] Hereinafter, the multilayer flexible printed wiring board of the present invention will be described with reference to the drawings.

[0045] In addition, in each figure, the same code|symbol is attached|subjected to the structural element which has an equivalent function, and detailed description of the structural element of the same code|symbol is not repeated. In addition, the drawings are schematic and are shown centering on the characteristic parts related to the embodiment, and the relationship between the thickness and the plane size, the ratio of the thickness of each layer, and the like are different from the actual ones.

[0046] First, refer to Figure 1 to Figure 3 , a method for manufacturing a multilayer flexible printed wiring board having a stepped via structure according to the present embodiment will be described.

[0047] (1) First, a double-sided copper-clad laminate 14 having copper foil 12 and copper foil 13 each having a thickness of 1 μm on both...

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PUM

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Abstract

Disclosed is a method of manufacturing, inexpensively and with stability, a multi-layer flexible printed circuit board having a small-diameter step-via structure. The multi-layer flexible printed circuit board is provided with: a flexible insulation base material (11); an insulation base material (21) laminated onto the back-face of the insulation base material (11) with an adhesive layer (24) interposed therebetween; step-via holes (25) comprising upper holes (26) that penetrate through the insulation base material (11), and lower holes (27) that penetrate through the adhesive layer (24) and the flexible insulation base material (21), and that has land sections (31) exposed at the bottom face thereof; land sections (30) formed on the surface of the insulation base material (11); land sections (17b) formed on the back-face of the insulation base material (11); and step-vias (29) comprising inter-layer conductor paths (29a) that connect the land sections (30) and the land sections (17b), and inter-layer conductor paths (29b) that connect the land sections (31) and the land sections (17b). The difference in the diameters of the upper holes (26) and the lower holes (27) in the roll direction of the flexible base material, which is the starting material, is made to be greater than the difference in the diameters of the upper holes (26) and the lower holes (27) in a direction perpendicular to the roll direction.

Description

technical field [0001] The present invention relates to a multilayer flexible printed wiring board and a manufacturing method thereof, more particularly to a multilayer flexible printed wiring board with a step via structure and a manufacturing method thereof. Background technique [0002] In recent years, miniaturization and high functionality of electronic devices have been progressing. Along with this, there has been an increasing demand for densification of printed wiring boards and components mounted on printed wiring boards. In particular, for package parts used in portable devices, the number of pins has increased and the pitch between pins has been narrowed. On the other hand, printed wiring boards are required to be thinner in consideration of wiring rules for mounting package components and assembly to portable devices. In order to reduce the thickness of printed wiring boards, flexible printed wiring boards using flexible insulating base materials such as polyim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/0097H05K1/112H05K3/421H05K2201/09845H05K2201/09854H05K2203/1545
Inventor 松田文彦
Owner NIPPON MEKTRON LTD
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