Second-order ladder groove bottom graphical printed board and processing method thereof

Abstract

The invention relates to the printed circuit board technology field, especially relating to a processing method of a second-order ladder groove bottom graphical printed board. The method comprises the following steps: carrying out a pretreatment on a first daughter board which reserves a plug-in hole, a second daughter board provided with a circuit graph and a third daughter board provided with a circuit graph; pressing the first daughter board and the second daughter board to obtain a first motherboard; carrying out distressing, hole drilling, copper deposition, internal layer figure transfer, and etching resistance metal protective layer plating treatments on the first motherboard to obtain a second motherboard; pressing the third daughter board and the second motherboard to obtain a third motherboard; carrying out distressing, hole drilling, copper deposition, external layer figure transfer treatments on the third motherboard to obtain a finished second-order ladder groove bottom graphical printed board. According to the second-order ladder groove bottom graphical printed board prepared by the method, each ladder can be subjected to wiring and plug-in installation, and a usage scope of a plate is expanded. The invention also relates to the second-order ladder groove bottom graphical printed board.

Description

Technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a patterned printed board at the bottom of a two-step step groove and a processing method thereof. Background technique [0002] At present, the prior art processes the patterned printed board at the bottom of the stepped groove. Generally, ink is used to fill the through hole at the bottom of the groove or a special tape is used to seal the through hole at the bottom of the stepped groove on one side. During the process of copper immersion, electroplating, and etching, the syrup passed through the through hole enters the pattern area at the bottom of the groove and attacks the circuit pattern in this area. [0003] However, this method of processing the patterned printed board at the bottom of the stepped groove does not really protect the patterned circuit at the bottom of the printed board. If the through hole at the bottom of the groove is completely filled, the patte...

AI Technical Summary

Problems solved by technology

[0003] However, this method of processing the patterned printed board at the bottom of the stepped groove does not really protect the patterned circuit at the bottom of the stepped groove of the printed board. If the method of filling all the through holes at the bottom of the groove is used, the patterned circuit at the bottom of the stepped groove cannot be installed. Plug-in devices, but SMD devices can only be installed at the bottom of the groove, and the scope of use of the board is limited

If a special tape is used to seal the through hole at the bottom of the step groove on one side, because the metallization holes and patterns at the bottom of the step are not really protected, and the etching solution will penetrate into the metallization at the bottom of the second step when making the second step Corrosion patterns and metallized holes in the holes make it impossible to produce two-step stepped printed boards; and the through-holes at the bottom of the stepped groove are sealed with special tape on one side. The tape is easy to fall off during the copper sinking process, and the liquid medicine seeps into the bottom of the stepped groove. Corrosion of graphics lines in the graphics area leads to the scrapping of printed boards; the position of tape can only be done in advance. If the existing method is used to make the printed board with graphics at the bottom of the second-order stepped groove, the existing technology cannot make the circuit at the position protected by tape graphics

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