Hybrid stacked structure composed of photo diode and capacitive secondary base

Abstract

The invention discloses a hybrid stacked structure composed of a photo diode and a capacitive secondary base, wherein the hybrid stacked structure comprises the capacitive secondary base and the photo diode; the capacitive secondary base comprises a heavy doped silicon base plate, a groove, a dielectric layer, a first electrode and a second electrode, wherein the groove forms on the upper surface of the silicon base plate; the dielectric layer forms on the upper surface or the lower surface of the silicon base plate; the first electrode deposits on the lower surface of the silicon base plate and forms an MIS (metal-insulator-semiconductor) capacitor together with the silicon base plate; the second electrode deposits on the upper surface of the silicon base plat and the surface of the groove; the photo diode is electrically pasted on the second electrode at the bottom of the groove; the bottom dimension of the groove is matched with the dimension of the photo diode, and the hybrid stacked structure has the function of accurate positioning for the photo diode.

Description

technical field [0001] The present invention relates to a presetted hybrid stack structure composed of a photodiode and a capacitive submount, in particular to a receiving optical sub-assembly (ROSA, receiving optical sub-assembly) in an optical communication component. assembly), a hybrid stack structure composed of photodiodes and capacitive submounts. Background technique [0002] In the optical receiver subassembly (ROSA) of existing optical communication components (such as TO-46 metal potting structure), the photosensitive diode must have a non-grounded electrical connection relationship, so the component must first be placed on a plane On a type insulating substrate, commonly referred to as a submount, a stacked structure isolated from ground is formed. Afterwards, the stacked structure is glued on a metal header for packaging, so that the photodiodes are insulated from the grounded metal header. However, if Figure 10 As shown, in order to mount a photodiode and a ...

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Problems solved by technology

However, if Figure 10 As shown, in order to mount a photodiode and a bypass (bypass) ceramic capacitor on this insulating substrate at the same time, the substrate must have an area sufficient to accommodate the photodiode and the ceramic capacitor, thus resulting in the need to increase the size of the substrate (such as Figure 9 shown)

In addition, when the photodiode is mounted on the insulating substrate, a primary positioning error of the component will occur; in addition, a secondary positioning error of the component will be further generated when the stacked structure is arranged on the metal can seat, and these positioning errors have cumulative effect, increasing the positioning error of the final device, which may lose the alignment of the optical axis (alignment)

Poor optical axis alignment will reduce the light flux receiving ability to meet the established specifications and prevent proper operation

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