227 results about "Metal insulator" patented technology

A device for regulating a flow of electric current and its manufacturing method are provided. The device includes metal-insulator-semiconductor source-drain contacts forming Schottky barrier or Schottky-like junctions to the semiconductor substrate. The device includes an interfacial layer between the semiconductor substrate and a metal source and/or drain electrode, thereby dynamically adjusting a Schottky barrier height by applying different bias conditions. The dynamic Schottky barrier modulation provides increased electric current for low drain bias conditions, reducing the sub-linear turn-on characteristic of Schottky barrier MOSFET devices and improving device performance.

Forming a metal-insulator diode and carbon memory element in a single damascene process is disclosed. A trench having a bottom and a sidewall is formed in an insulator. A first diode electrode is formed in the trench during a single damascene process. A first insulating region comprising a first insulating material is formed in the trench during the single damascene process. A second insulating region comprising a second insulating material is formed in the trench during the single damascene process. A second diode electrode is formed in the trench during the single damascene process. The first insulating region and the second insulating region reside between the first diode electrode and the second diode electrode to form a metal-insulator-insulator-metal (MIIM) diode. A region of carbon is formed in the trench during the single damascene process. At least a portion of the carbon is electrically in series with the MIIM diode.

This disclosure describes one-chip micro-integrated optoelectronic sensors and methods for fabricating and using the same. The sensors may include an optical emission source, optical filter and a photodetector fabricated on the same transparent substrate using the same technological processes. Optical emission may occur when a bias voltage is applied across a metal-insulator-semiconductor Schottky contact or a p-n junction. The photodetector may be a Schottky contact or a p-n junction in a semiconductor. Some sensors can be fabricated on optically transparent substrate and employ back-side illumination. In the other sensors provided, the substrate is not transparent and emission occurs from the edge of a p-n junction or through a transparent electrode. The sensors may be used to measure optical absorption, optical reflection, scattering or fluorescence. The sensors may be fabricated and operated to provide a selected spectrum of light emitted and a multi-quantum well heterostructure may be fabricated to filter light reaching the photodetector.

A metal insulator semiconductor field effect transistor (MISFET) having a strained channel region is disclosed. Also disclosed is a method of fabricating a semiconductor device having a low-resistance junction interface. This fabrication method includes the step of forming a gate electrode above a silicon substrate with a gate insulator film being sandwiched therebetween. Then, form a pair of heavily-doped p (p⁺) type diffusion layers in or on the substrate surface at both sides of the gate electrode to a concentration of 5×10¹⁹ atoms/cm³ or more and yet less than or equal to 1×10²¹ atoms/cm³. Next, silicidize the p⁺-type layers by reaction with a metal in the state that each layer is applied a compressive strain.

A tunable metamaterial has a two dimensional array of resonant annular ring elements; and a plurality of voltage controllable electrical tuning elements disposed in or adjacent openings in each of said ring elements, each of said voltage controllable electrical tuning element ohmically contacting portions of only one of said ring elements. The voltage controllable electrical tuning elements may comprise highly doped semiconductor tunnel diodes, or the charge accumulation layer at the semiconductor/insulator interface of a metal-insulator-semiconductor structure, or nanoelectromechanical (NEMs) capacitors. The tunable metamaterial may be used, for example, in an optical beam steering device using the aforementioned tunable optical metamaterial in which a free-space optical beam is coupled into a receiving portion of a plane of the optical metamaterial and is steered out of a transmitter portion of the plane of the optical metamaterial in controllable azimuthal and elevational directions. The tunable metamaterial additionally has other applications.

A metal-insulator diode is disclosed. In one aspect, the metal-insulator diode comprises first and second electrode and first and second insulators arraigned as follows. An insulating region has a trench formed therein. The trench has a bottom and side walls. The first electrode, which comprises a first metal, is on the side walls and over the bottom of the trench. A first insulator has a first interface with the first electrode. At least a portion of the first insulator is within the trench. A second insulator has a second interface with the first insulator. At least a portion of the second insulator is within the trench. The second electrode, which comprises a second metal, is in contact with the second insulator. The second electrode at least partially fills the trench.

A metal-insulator diode is disclosed. In one aspect, the metal-insulator diode comprises a first electrode comprising a first metal, a first region comprising a first insulating material, a second region comprising a second insulating material, and a second electrode comprising a second metal. The first region and the second region reside between the first electrode and the second electrode. The second insulating material is doped with nitrogen. Note that the second insulating material may have an interface with either the first electrode or the second electrode.

A memory circuit that retains stored data upon power down includes a volatile data storage circuit; and at least one nonvolatile memory coupled within the volatile data storage circuit, wherein the at least one nonvolatile memory includes a high resistive state and a low resistive state. The volatile data storage circuit can include cross-coupled inverters, cross- coupled NAND gates, or another volatile data storage circuit. The nonvolatile memories can include a spin-injection magnetic tunnel junction memory, a magnetic tunnel junction memory, a metal insulator phase change memory, an organic memory, or some other memory with two resistive states.

A metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) has a substrate in which an electron supply layer is interposed between an electron channel layer and the surface of the substrate. A pair of main electrodes are formed on the surface of the substrate. A recess is formed in the surface of the substrate between the main electrodes. A gate insulation film is formed on the surface of the substrate, at least between the first and second main electrodes, covering the inside walls and floor of the recess. A gate electrode is formed on the gate insulation film, filling in the recess. The gate insulation film has a crystal density of at least 2.9 g/cm³, which mitigates the reduction in threshold voltage caused by the recess.

Photovoltaic (PV) devices employing layers of semiconducting carbon nanotubes as light absorption elements are disclosed. In one aspect a layer of p-type carbon nanotubes and a layer of n-type carbon nanotubes are used to form a p-n junction PV device. In another aspect a mixed layer of p-type and n-type carbon nanotubes are used to form a bulk hetero-junction PV device. In another aspect a metal such as a low work function metal electrode is formed adjacent to a layer of semiconducting nanotubes to form a Schottky barrier PV device. In another aspect various material deposition techniques well suited to working with nanotube layers are employed to realize a practical metal-insulator-semiconductor (MIS) PV device. In another aspect layers of metallic nanotubes are used to provide flexible electrode elements for PV devices. In another aspect layers of metallic nanotubes are used to provide transparent electrode elements for PV devices.

A device includes a gate structure and a nanowire channel structure positioned under the gate structure. The nanowire channel structure includes first and second end surfaces. The device further includes a first insulating liner positioned on the first end surface and a second insulating liner positioned on the second end surface. The device further includes a metal-containing source contact positioned on the first insulating liner and a metal-containing drain contact positioned on the second insulating liner.

The invention discloses an AIN/GaN reinforced metal-insulator-semiconductor field effect transistor, mainly solving the problem that high-threshold voltage and large output current can not be realized at the same time in the existing device. The AIN/GaN reinforced metal-insulator-semiconductor field effect transistor is mainly characterized in that an AIN barrier layer is adopted to increase the concentration of channel two-dimensional electron gas and increase the output current at the time of high-threshold voltage. The manufacturing process comprises the following steps: growing an AIN nucleating layer on a substrate; growing an AI0.07GaN epitaxial layer on the AIN nucleating layer; growing a GaN layer on the AI0.07GaN epitaxial layer; growing an AIN barrier layer with a thickness of 3-6nm on the GaN layer; after the completion of material growing, photo-etching and vaporizing source-drain metals on the AIN barrier layer; photo-etching and etching a grooved gate between the source and the drain; after the grooved gate is etched, depositing SiN gate dielectric layers on the surfaces of the grooved gate and the AIN barrier layer; and photo-etching and vaporizing gate metals on the SiN gate dielectric layers and interconnecting the metals. The invention is applicable to the production of switch devices with high-threshold voltage and small transmission resistance.

A method of making an n-channel metal-insulator-semiconductor field-effect transistor (MISFET) that exhibits negative differential resistance in its output characteristic (drain current as a function of drain voltage) is disclosed. By implanting ions into a substrate that is later thermally oxidized, a number of temporary charge trapping sites can be established above a channel region of a transistor. The channel is also heavily doped, so that a strong electrical field can be generated to accelerate hot carriers into the temporary charge trapping sites. The insulating layer formed during the oxidation step is made sufficiently thick to prevent quantum tunnelingo of the hot carriers into a gate electrode. Other suitable and conventional processing steps are used to finalize completion of the fabrication of the NDR device so that the entire process is compatible and achieved with CMOS processing techniques.

Non-silicon metal-insulator-semiconductor (MIS) devices and methods of forming the same. The non-silicon MIS device includes a gate dielectric stack which comprises at least two layers of non-native oxide or nitride material. The first material layer of the gate dielectric forms an interface with the non-silicon semiconductor surface and has a lower dielectric constant than a second material layer of the gate dielectric. In an embodiment, a dual layer including a first metal silicate layer and a second oxide layer provides both a good quality oxide-semiconductor interface and a high effective gate dielectric constant.

The invention discloses a metal-insulator-semiconductor (MIS) grid enhanced high electron mobility transistor (HEMT) device based on gallium nitride (GaN) and a manufacture method of the MIS grid enhanced HEMT device and mainly solves the problems that the current density and the reliability of the existing GaN base enhanced device are low. The device is structurally characterized in that a transition layer (2) and a GaN main buffer layer (3) are sequentially arranged on a substrate (1), the middle of the GaN main buffer layer (3) is provided with a groove (11), an AlGaN main barrier layer (4) is arranged above the GaN main buffer layer arranged at two sides of the groove, a GaN sub buffer layer (5) and an AlGaN sub barrier layer (6) are sequentially arranged on the surface of the AlGaN main barrier layer (4) arranged above the groove inner wall and the two sides of the groove, the two sides of the top end of the AlGaN sub barrier layer (6) are respectively a source electrode (8) and a drain electrode (9), a medium layer (7) is arranged outside the source electrode and the drain electrode, a grid electrode (10) is arranged on the medium layer (7) and covers the whole groove region, and the mature flow process is adopted for the whole device manufacture. The MIS grid enhanced HEMT device has the advantages that the enhanced type characteristics are good, the current density is high, the breakdown voltage is high, and the device reliability is high. The MIS grid enhanced HEMT device can be used in high-temperature high-frequency high-power devices, high-power switches and digital circuits.

A metal insulator semiconductor field effect transistor (MISFET) is disclosed comprising a source layer being made with a material having a source band-gap (EG2) and a source mid-gap value (EGM2), the source layer having a source Fermi-Level (EF2). A drain layer has a drain Fermi-Level (EF4). A channel layer is provided between the source layer and the drain layer, the channel layer being made with a material having a channel band-gap (EG3) and a channel mid-gap value (EGM3), the channel layer having a channel Fermi-Level (EF3). A source contact layer is connected to the source layer opposite the channel layer, the source contact layer having a source contact Fermi-Level (EF1). A gate electrode has a gate electrode Fermi-Level (EF6). The source band-gap is substantially narrower (EG2) than the channel band-gap (EG3). The source contact Fermi-Level (EF1), the source Fermi-Level (EF2), the channel Fermi-Level (EF3), the drain Fermi-Level (EF4) and the gate electrode Fermi-Level (EF6) are equal to the source mid-gap value (EGM2) and the channel mid-gap value (EGM3), within a predetermined tolerance value, when no voltage is applied to the device.

The invention provides a sperjunction IGBT (Insulated Gate Bipolar Transistor) device. A semiconductor region of the second conductivity type in a voltage resistance layer is connected with an emitterthrough a bipolar transistor of a base open circuit; the bipolar transistor of the base open circuit and the semiconductor region of the second conductivity type in the voltage resistance layer are isolated from a base region through a slot gate structure; the bipolar transistor of the base open circuit and the slot gate structure form an MISFET (metal-Insulator-Semiconductor Field Effect Transistor) with a floating substrate; and an electrode of the slot gate structure can be connected with a gate or the emitter. The bipolar transistor of the base open circuit can help to enhance the carrierstorage effect in a voltage resistance region during forward conduction, thereby reducing a conduction voltage drop.

An integrated photosensitive device with a metal-insulator-semiconductor (MIS) photodiode constructed with one or more substantially continuous layers of semiconductor material and with a substantially continuous layer of dielectric material.