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Compression molding method and compression mold for semiconductor chip

A compression molding, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of inability to efficiently improve product productivity, longer resin material supply time, and increased production costs.

Inactive Publication Date: 2012-05-16
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In addition, in the case of using the above-mentioned divided cavity structure, since the metered and flattened granular resins are supplied into the divided cavities respectively, the supply mechanism of the resin material is a complicated structure.
As a result, its production cost increases, and the supply time of the resin material (particulate resin) becomes longer
Therefore, there is a disadvantage that the productivity of products (molded substrates) cannot be efficiently improved.

Method used

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  • Compression molding method and compression mold for semiconductor chip
  • Compression molding method and compression mold for semiconductor chip
  • Compression molding method and compression mold for semiconductor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] First, use Figure 1~Figure 9 and Figure 13A Example 1 will be described in detail. figure 1 , figure 2 , image 3 ,Figure 4, Figure 5 , Figure 7 and Figure 8 This is the mold for compression molding of the semiconductor chip of Example 1. Image 6 It is a cavity bottom surface member set in the mold of Example 1, and a partition member that is detachably installed on the cavity bottom surface member. Picture 9 It is a partition member installed on the bottom surface member of the cavity, and the bottom surface member of the cavity is installed on the mold of Example 1. Figure 13A This is the molded substrate of Example 1.

[0042] Regarding the substrate used in this embodiment

[0043] On the substrate 1 used in the present embodiment, semiconductor chips 2 such as IC (Integrated Circuit) are mounted in a matrix-type configuration as necessary. In addition, in this embodiment, the molded substrate 4 can be formed by sealing the semiconductor chips 2 mounted in a mat...

Embodiment 2

[0092] Next, use Picture 10 , Figure 11A~Figure 11C , Figure 13B Example 2 will be described in detail.

[0093] Picture 10 , Figure 11A~Figure 11C This is the mold for compression molding of the semiconductor chip of Example 2. Figure 13B It is a molded substrate molded using the mold shown in Example 2. In addition, since the basic structure of the mold shown in Example 2 is the same as that of the mold shown in Example 1, a detailed description thereof will not be repeated. In addition, the substrate used in Example 2 is the same as the substrate used in Example 1. In addition, the mold of Example 2 is provided with sprues on both sides of the partition member in the lower cavity.

[0094] About the structure of the mold for compression molding of semiconductor chips of Example 2

[0095] in Picture 10 and Figure 11A~Figure 11C In the shown mold 41, the upper mold 42 and the lower mold 43 are provided in the same manner as in Example 1. In addition, the mold 41 include...

Embodiment 3

[0114] Next, use Figure 12A~Figure 12B Example 3 will be described in detail. Figure 12A~Figure 12B It is the main part of another mold for compression molding of semiconductor chips, and a partition member is detachably provided on the cavity bottom member. In addition, since the basic structure of the mold shown in Example 3 is the same as that of the mold shown in Example 1, the detailed description thereof will not be repeated. In addition, the substrate used in Example 3 is the same as the substrate used in Example 1.

[0115] About the structure of the mold for compression molding of semiconductor chips of Example 3

[0116] The basic structure of the mold shown in Example 3 is the same as that of the mold shown in Example 1. in Figure 12A~Figure 12B In the shown mold, the cavity bottom surface member 141 and the partition member 142 are provided in the same manner as in Example 1. It is provided so that the partition member 142 can be attached to the cavity bottom surf...

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Abstract

The invention provides a compression molding method for semiconductor chips and a compression molding mold. According to the compression molding method for semiconductor chips, the top end surface of a mould cavity bottom member is provided with separating elements arranged at assigned positions. Therefore, a plurality of segmented mold cavities are formed inside a low mould cavity. In addition, the height of separating elements are set to be the thickness of a resin molding body. Semiconductor chips arranged on a substrate are wrapped into a plurality of resin molding bodies arranged corresponding to the shapes of the plurality of segmented mold cavities, so that a movement distance of a minimal limit is formed for the upward movement of the mould cavity bottom member. Meanwhile, the resin in the segmented mold cavities is exerted with a force so as to from segmented resin molding bodies. In addition, groove parts formed between the segmented resin molding bodies are corresponding to the shapes of the separating elements and are used for the warpage of the substrate.

Description

Technical field [0001] The present invention relates to a compression molding method and a compression molding die for forming a semiconductor chip of a molded substrate by sealing a semiconductor chip mounted on a substrate in a resin molding body. Background technique [0002] Conventionally, a mold for compression molding of semiconductor chips is used, and a plurality of necessary semiconductor chips arranged in a matrix type mounted on a substrate are all compression molded in a resin molded body at the same time. The method proceeds as described below. [0003] First, use a resin material supply mechanism including a shutter type supply part to supply the required amount of pelletized resin material (pellet resin) to the shutter type supply part, and then flatten the resin material (pellet resin) to the required amount Equal thickness. Next, by opening the gate of the sluice-type supply unit, the flattened pellet resin is dropped into the lower cavity (large cavity) for com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C39/10B29C39/26
CPCH01L24/97H01L2924/14H01L2924/00H01L21/56H01L23/28
Inventor 川本佳久田村孝司
Owner TOWA
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