Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package

Abstract

A stacked semiconductor package has a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate, and a plurality of connections electrically connecting the first and second semiconductor packages. The connections are disposed on an outer region of the first package substrate outside the first semiconductor chip. The connections are disposed along opposite first longer sides and opposite shorter second sides of the first package substrate. The heights of those connections disposed along each longer first side gradually vary from a central to an outer region (i.e., the ends) of the longer first side.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2010-0100327 filed with the Korean Intellectual Property Office on October 14, 2010, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The inventive concept relates to semiconductor devices. More particularly, the inventive concept relates to a stacked type semiconductor package and to a method of manufacturing the stacked type semiconductor package. Background technique [0003] Many electronic devices are now becoming smaller and more compact and more functional, and they tend to become more prevalent. Accordingly, there is an increasing demand for smaller, thinner, and lighter semiconductor packages, and for semiconductor chips with higher capacity (eg, data storage capacity) in a given amount of space. However, there are limitations as to how much capacity a semiconductor chip can have within a certain amount of space. Accordingly, a stacke...

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However, there are limitations as to how much capacity a semiconductor chip can have in a given amount of space

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