Metal substrate and light source device
A technology for metal substrates and light source devices, applied to electrical components, electrical solid devices, circuits, etc., can solve problems such as insufficient heat release characteristics, and achieve the effect of suppressing the reduction of luminous efficiency and the increase of surface temperature
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no. 1 Embodiment approach
[0064] A cross-sectional view of the metal substrate of the first embodiment is shown in figure 1 . The metal substrate 100 has an Al plate 111 in which a Ni layer 112 is laminated on the entire surface of one side as a heat dissipating metal plate. A white film 120 made of insulating resin is laminated on a part of the Ni layer 112 . A wiring pattern formed of Cu foil 131 is formed on white film 120 . On Cu foil 131, Ni layer 132 and Au layer 133 are laminated in this order. The white thin film 120 has a through-hole 120 a in a part thereof, and an Au layer 114 is laminated via the Ni layer 113 on the Ni layer 112 exposed at the position of the through-hole. The surface of the Au layer 114 is a light source mounting surface.
[0065] use figure 2 (a)-(d) The manufacturing process of the metal substrate 100 is demonstrated.
[0066] First, if figure 2 As shown in (a), Cu foil 131 is laminated on one side of white film 120 to form a copper-clad laminate.
[0067] Next...
no. 2 Embodiment approach
[0081] Figure 7 A cross-sectional view showing a metal substrate of the second embodiment. The metal substrate 200 has an Al plate 211 in which a Ni layer 212 is laminated on the entire surface of one side as a heat dissipating metal plate. A first white film 221 made of insulating resin is laminated on a part of the Ni layer 212 . A wiring pattern formed of Cu foil 231 is formed on the first white film 221 , and a second white film 222 made of insulating resin is laminated so that a part of the wiring pattern is exposed. A Ni layer 232 and an Au layer 233 are laminated in this order on the partially exposed surface of the Cu foil 231 . Parts of the first white thin film 221 and the second white thin film 222 have through holes 221a and 222a, respectively, and an Au layer 214 is laminated via a Ni layer 213 on the Ni layer 212 exposed at the positions of the through holes. The surface of the Au layer 214 is a light source mounting surface.
[0082] use Figure 8 (a) to (...
no. 3 Embodiment approach
[0091] Figure 10 A cross-sectional view showing a metal substrate of a third embodiment. The metal substrate 300 has a Cu plate 311 as an exothermic metal plate. A first white film 321 made of insulating resin is laminated on a part of the Cu plate 311 . A wiring pattern made of Cu foil 331 is formed on the first white film 321 , and a second white film 322 made of insulating resin is laminated so that a part of the wiring pattern (Cu foil 331 ) is exposed. A Ni layer 332 and an Au layer 333 are laminated in this order on a part of the exposed surface of the wiring pattern (Cu foil 331 ). Parts of the first white film 321 and the second white film 322 have through holes 321a, 322a, respectively, and an Au layer 314 is laminated via a Ni layer 313 on the surface of the Cu plate 311 exposed at the positions of the through holes. The surface of the Au layer 314 is a light source mounting surface.
[0092] use Figure 11 (a) to (d) describe the manufacturing process of the m...
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