Keyboard

A keyboard and keypad technology, applied in the direction of electrical components, electric switches, circuits, etc., can solve the problems affecting the thickness of mobile phones, design difficulties, etc., and achieve the effect of good pressing feel, reliable structure, and overall thickness reduction

Active Publication Date: 2015-07-22
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when there are certain requirements for the thickness of the mobile phone, such as designing a slide phone, a clamshell phone and an ultra-thin bar phone, the above settings will greatly affect the thickness of the phone, making the design more difficult

Method used

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Embodiment Construction

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0019] In the description of the present invention, the orientation or positional relationship indicated by the terms "inner", "outer", "upper", "lower", "top", "bottom" etc. are based on the orientation or positional relationship shown in the drawings, The disclosure is merely for convenience in describing the invention and does not require that the invention must be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

[0020] Refer below Figure 1-Figure 5 A keyboard accord...

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PUM

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Abstract

The invention discloses a keyboard comprising a silica gel substrate, a plurality of touch parts and a plurality of keycaps. The silica gel substrate is provided with a plurality of mutually spaced keyfields, wherein one part of the silica gel substrate is upwards heaved from the silica gel substrate to form each keyfield; each keyfield comprises a connection part and connection walls at the periphery of the connection part; and the connection part is composed of the top wall of the keyfield and is connected with the silica gel substrate by the connection walls. The plurality of touch parts respectively extend out downwards from the connection parts of the plurality of the keyfields and the downward extended height is less than the height of the connection walls. The plurality of the keycaps are respectively arranged on the surface of the plurality of the keyfields. With the adoption of the keyboard of the embodiment, the overall thickness of the overall machine can be reduced due to that the downward extended height of the touch parts of the keyfields is less than the convex height of the keyfields, namely no more than the plane where the bottom face of the silica gel substrate exists, great advantages are brought to design of an ultrathin machine, press feeling is good, and the structure is reliable.

Description

technical field [0001] The invention relates to the field of digital products, in particular to a keyboard for digital products. Background technique [0002] The structure of the traditional mobile phone keyboard is as follows: Figure 6 to Figure 8 As shown, including a silicone base 1 and a keycap 4, a keypad 2 is formed on the silicone base 1, and the lower surface of the keypad 2 ( Figure 7 The right side surface in the middle) has a contact 3 to contact with the protrusion or shrapnel on the printed circuit control board of the mobile phone so as to operate the mobile phone. [0003] Such as Figure 7 As shown, in order to make the contact 3 contact with the protrusion or shrapnel on the printed circuit control board of the mobile phone, the contact 3 needs to exceed the plane where the bottom of the silicone base 1 is located by about 0.3 mm. However, when there are certain requirements on the thickness of the mobile phone, such as when designing a slide phone, a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H13/70H01H13/703H01H13/705
Inventor 王保平李宇鹏马铭曾铖张建安付雄伟
Owner BYD CO LTD
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