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Light emitting diode (LED) packaging structure and manufacturing method thereof

A technology for light-emitting diodes and packaging structures, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as affecting the yield of finished products, technical difficulties, and mechanical equipment space limitations.

Inactive Publication Date: 2012-06-06
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the light-emitting diode chip needs to be installed in the recess, the mechanical equipment needs to be inserted into the recess when bonding the die or flipping the chip. The space for the mechanical equipment operation is limited. One is more difficult technically, and the other is easy to affect Yield of finished product

Method used

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  • Light emitting diode (LED) packaging structure and manufacturing method thereof
  • Light emitting diode (LED) packaging structure and manufacturing method thereof
  • Light emitting diode (LED) packaging structure and manufacturing method thereof

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Embodiment Construction

[0034] Such as Image 6 with Figure 8 As shown, the light emitting diode packaging structure of an embodiment of the present invention includes a substrate 10, an electrode 20 formed on the substrate 10, a light emitting diode chip 30 mounted on the substrate 10 and electrically connected to the electrode 20, and a shell surrounding the substrate 10 Body 40, and encapsulation layer 50 covering LED chip 30. The casing 40 includes a surrounding wall 41 , the height of which is greater than the thickness of the substrate 10 , so that the surrounding wall 41 higher than the substrate 10 forms a reflective cup structure. A circuit structure 43 is installed on the bottom of the surrounding wall 41 , and the electrode 20 of the substrate 10 leans against the circuit structure 43 .

[0035] Hereinafter, the manufacturing method of the light emitting diode packaging structure of the technical solution will be described in detail in combination with other drawings and embodiments.

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Abstract

The invention relates to a light emitting diode (LED) packaging structure and a manufacturing method thereof. An LED chip forms electrical connection with a substrate. Then the LED chip is arranged in a shell so as to form a reflection cup. Therefore, the reflection cup can not block mechanical equipment to operate flexibly in an electrical connection state, such as a wiring or flip-chip process. The LED packaging structure after the packaging possesses the reflection cup so that luminescence and reflection efficiency can be increased.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure of a light emitting diode, and also to a method for manufacturing the packaging structure of the light emitting diode. Background technique [0002] In the prior art, in order to improve the luminous efficiency of a light emitting diode (Light Emitting Diode, LED), a reflective cup structure is usually formed on the packaging substrate first, and then die-bonding or flip-chip is used in the depression formed by the reflective cup Install light emitting diode chips. [0003] Since the light-emitting diode chip needs to be installed in the recess, the mechanical equipment needs to be inserted into the recess when bonding the die or flipping the chip. The space for the mechanical equipment operation is limited. One is more difficult technically, and the other is easy to affect Yield of finished product. Contents of the invention [0004] In view of this, the present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/60
CPCH01L33/486H01L33/62H01L33/60H01L2224/48227H01L2224/48091H01L2924/00014
Inventor 张耀祖
Owner ZHANJING TECH SHENZHEN