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Encapsulating structure for lighting LED lamp strip

A technology of LED light bar and packaging structure, which is applied in the direction of electrical components, electric solid devices, circuits, etc., which can solve the problems of increasing secondary optical structure materials and manufacturing costs, increasing the difficulty of heat dissipation of LED lamps, and reducing the luminous rate of LED lamp beads, etc. , to achieve the effect of eliminating the need for secondary optical design, improving the heat dissipation conditions of the die, saving materials and production links

Inactive Publication Date: 2012-06-27
陈林
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The secondary optical design reduces the luminous efficiency of LED lamp beads by about 20%, which increases the material and manufacturing costs of the secondary optical structure, and also increases the difficulty of heat dissipation of LED lamps
[0005] The above two problems are important reasons for increasing production costs and reducing lamp life

Method used

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  • Encapsulating structure for lighting LED lamp strip
  • Encapsulating structure for lighting LED lamp strip
  • Encapsulating structure for lighting LED lamp strip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The present invention will be further described below in conjunction with drawings and embodiments. see Figure 4 , the present invention is provided with a circuit substrate 6 , a transparent cup bar 4 , several LED tube cores 7 , fluorescent colloid 8 , and an outer package 10 .

[0029] see figure 1 , The circuit can basically be made of PCB circuit board, aluminum substrate or ceramic substrate, and the pads and corresponding connected wires are arranged on the circuit substrate. The circuit substrate is also designed with external pins to facilitate the assembly of the finished product.

[0030] see figure 2 , The transparent cup bar is made of a transparent material, such as plexiglass, and several through holes are processed on the cup bar.

[0031] see image 3 , the base of the light bar is composed of a circuit substrate and a transparent cup strip. The through holes on the cup strip are in the same position as the pads on the circuit substrate, and the ...

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PUM

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Abstract

The invention provides an LED lamp strip whose a plurality of LED tube cores are directly mounted on a circuit substrate. The encapsulating structure comprises a circuit board substrate, a transparent bowl cup strip, the plurality of LED tube cores, fluorescent colloid coated on the tube cores and a transparent external encapsulating material, wherein the transparent bowl cup strip is combined with the circuit board substrate to from a lamp strip foundation support provided with a plurality of mounting depressions; one LED tube core is encapsulated in each mounting depression of the lamp strip foundation support; LED tube cores are fixedly bound on a manufactured circuit bonding pad of the circuit substrate via linkage and weld lines; fluorescent colloid are coated in the mounting depressions and covered with the bond LED tube cores; the bowl cup strip and the tube cores are encapsulated by the transparent external encapsulating material, thus forming an outer covering layer to protect the tube cores and the fluorescent colloid; and the outer covering layer is combined with the lamp strip to form a whole LED lighting strip.

Description

Technical field [0001] The invention relates to an LED package structure for illumination, in particular to an LED product for illumination with low cost, high production efficiency and good heat dissipation. Background technique [0002] LED lighting devices have the characteristics of energy saving and longevity, and meet the requirements of the country to encourage the development of green lighting and low-carbon society. Its products have a good market prospect. However, due to problems such as high production costs and serious light attenuation caused by poor heat dissipation, the promotion and use of LED lamps has been limited. Through the analysis of the production process of LED lighting products, it is believed that there are two practical problems to be solved: [0003] 1. At present, the production process of LED lighting fixtures is divided into two steps, that is, the LED tube core is packaged into LED lamp beads by the packaging factory first, and then the lam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/62
CPCH01L2224/48091H01L2224/73265H01L2924/181
Inventor 陈林
Owner 陈林
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