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Adhesive composition for semiconductor and adhesive film with the same

A technology of adhesives, compositions, applied in the direction of film/sheet adhesives, adhesive types, semiconductor devices, etc., can solve the problems of additional processes and reduced productivity

Active Publication Date: 2012-07-04
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is disadvantageous due to additional process and reduced productivity

Method used

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  • Adhesive composition for semiconductor and adhesive film with the same
  • Adhesive composition for semiconductor and adhesive film with the same
  • Adhesive composition for semiconductor and adhesive film with the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0094] Details of the components used in Examples and Comparative Examples are described below.

[0095] (A1) Binder resin: SG-P3 (Nagase Chemtex)

[0096] (A2) Binder resin: SBR 1000 (Emulsion Styrene Butadiene Rubber, Kumho Petrochemical)

[0097] (B1) Epoxy resin: YDCN-500-1P (Kukdo Chemical)

[0098] (B2) Epoxy resin: NC-3000 (Nippon Kayaku)

[0099] (C1) Amine curing agent: C-300S (Nippon Kayaku, equivalent weight: 78)

[0100] (C2) Amine curing agent: DDS (Wako, equivalent weight: 67)

[0101] (D) Silane coupling agent: KBM-403 (Shinetsu)

[0102] (E) Filler: SO-25H (ADMATECH)

[0103] (F) solvent: cyclohexanone

[0104] Table 1 (solid content)

[0105] Example 1

Example 2

Example 3

Example 4

(A1)

36.5

36.5

36.5

60

(B1)

0

0

10

0

(B2)

20

20

10

12.6

(C1)

0.1

5

5

3.15

(C2)

9.9

5

5

3...

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Abstract

The present invention provides an adhesive composition for semiconductor and an adhesive film with the same. The adhesive composition has a compressive strength in 100-1500gf / mm2 at 150 DEG C after curing for 30 minutes at 125 DEG C. According to the adhesive composition for the semiconductor, semi-curing process can be shortened or omitted, and the semi-curing process is performed after jointing a same-type chip. The adhesive composition for the semiconductor ensures a least modulus in lead joint after chip jointing, and provides a residual curing rate in a plurality of curing processes for facilitating elimination of gaps in EMC forming.

Description

technical field [0001] The present invention relates to an adhesive composition for semiconductors and an adhesive film comprising the composition. More specifically, the present invention relates to an adhesive composition for semiconductors, which ensures minimum modulus in wire bonding after die bonding to have excellent initial reliability, and realizes bonding in die bonding by an amine curing agent. Subsequent multiple curing processes provide a residual curing rate in the higher reaction temperature range, which facilitates the elimination of voids in EMC molding. The invention also relates to an adhesive film comprising the composition. Background technique [0002] In order to realize a semiconductor device with high capacity, a qualitative high integration method of increasing the number of cells per unit area and a quantitative packaging method of depositing a plurality of chips to increase capacity are used. [0003] As a packaging method, a multi-chip package ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/04C09J163/00C09J7/00H01L23/29
CPCH01L24/29C09J7/35C09J9/00C09J133/04C09J163/00C09J2203/326C09J2301/304C09J2301/312C09J2301/408H01L21/6836H01L2221/68327
Inventor 朴白晟鱼东善宋基态崔裁源金仁焕
Owner CHEIL IND INC