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Adhesive composition for semiconductor and adhesive film containing it

A technology of adhesives and compositions, applied in the field of adhesive compositions for semiconductors, can solve problems such as additional processes and reduced productivity, and achieve the effects of improving processability and reliability, and eliminating voids

Active Publication Date: 2016-12-14
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has the inconvenience of additional process and reduced productivity

Method used

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  • Adhesive composition for semiconductor and adhesive film containing it
  • Adhesive composition for semiconductor and adhesive film containing it
  • Adhesive composition for semiconductor and adhesive film containing it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0105] Details of the components used in Examples 1 to 8 and Comparative Examples 1 and 2 are as follows.

[0106] (A) Thermoplastic resin: SG-P3 (Nagase Chemtex)

[0107] (B1) Epoxy resin: YDCN-500-90P (Kukdo Chemical)

[0108] (B2) Epoxy resin: NC-3000 (Nippon Kayaku)

[0109] (C) Phenolic curing agent: MEH-7851SS (Meiwa Plastic Industries)

[0110] (D) Amine curing agent: DDS (Wako, equivalent weight: 65)

[0111] (E) Anhydride curing resin: phthalic anhydride (Sigma-Aldrich, MP: 130°C)

[0112] (F) Silane coupling agent: KBM-403 (Shinetsu)

[0113] (G) Curing accelerator: TPTP (HOKKO Chemical Industries., MP: 146°C)

[0114] (H) Filler: SO-25H, (ADMATECH)

[0115] (1) solvent: cyclohexanone

[0116] Table 1

[0117]

Example 1

Example 2

Example 3

Example 4

Example 5

Example 6

Example 7

Example 8

(A)

36.9

32

27

32

16.0

31.4

29.9

28.6

(B1)

0

0

0

10

0.0

0.0

0.0

0.0

...

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Abstract

The present disclosure provides an adhesive composition for semiconductors having two exothermic peaks between 65°C and 350°C and cured at 150°C for 10 minutes and 150°C for 30 minutes , and then measured after molding at 175°C for 60 seconds to have a void area ratio of less than 10%, wherein the first exothermic peak appears between 65°C and 185°C, and the second exothermic peak appears between 155°C and 350°C hot peak. The adhesive composition for semiconductors can shorten or omit the prepreg process that must be performed after bonding the same type of chips.

Description

technical field [0001] The present invention relates to an adhesive composition for semiconductors and an adhesive film comprising the same. More specifically, the present invention relates to adhesive compositions for semiconductors that allow shortening or omission of the semi-curing process that must be included after chip bonding and still provide curing after various processes after chip bonding rate, thereby facilitating the removal of voids in EMC molding. The invention also relates to adhesive films comprising it. Background technique [0002] In order to realize a semiconductor device with high capacity, a qualitative high integration method of increasing the number of cells per unit area and a quantitative packaging method of depositing a plurality of chips to increase capacity are used. [0003] As a packaging method, multi-chip packaging (MCP) is generally used in which multiple chips are deposited using an adhesive and the upper and lower chips are electricall...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/00C09J163/00C09J201/00C09J7/02C09J11/00C09J7/10
CPCC08L63/00H01L24/83H01L2224/92165H01L24/27H01L24/29H01L24/48H01L24/73H01L24/94H01L25/0657H01L25/50H01L2224/27436H01L2224/2929H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29386H01L2224/32145H01L2224/32225H01L2224/48145H01L2224/73215H01L2224/83191H01L2224/83862H01L2224/94H01L2924/00014H01L2225/06506H01L2924/181C09J7/10C09J163/00H01L2224/27H01L2924/05442H01L2224/45099H01L2924/00H01L2924/00012
Inventor 朴白晟宋基态鱼东善金仁焕
Owner CHEIL IND INC