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Method for inspecting substrate

A substrate and benchmark technology, applied in measurement devices, instruments, electrical components, etc., can solve the problems of reduced high reliability of the target, deviation of multiple projection parts, insufficient effective data in the background area, etc., to improve reliability, Effects of Compensating Errors, Improving Accuracy and Reliability

Active Publication Date: 2012-07-04
株式会社高迎科技 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, noisy data cannot be ruled out
In addition, when the target is an electronic device with a height, there is a shadow caused by the electronic device, which leads to insufficient effective data in the background area, thereby reducing the reliability of the height of the target
In addition, measurement data may be tilted depending on the environment of the substrate, which may cause deviations among multiple projection parts, reducing the reliability of integrated height data

Method used

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  • Method for inspecting substrate
  • Method for inspecting substrate
  • Method for inspecting substrate

Examples

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Embodiment Construction

[0038] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. However, the invention can be implemented in many different ways and should not be considered limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough, and will fully convey the scope of the invention to those skilled in the art. The size and relative sizes of certain layers and regions in the drawings may be exaggerated for clarity. Like reference numerals denote like parts in the drawings.

[0039] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0040] figure 1 is a schematic diagram showing a substrate inspection device.

[0041] refer to figure 1 , The substrate inspection apparatus 100 according to an exemplary embodiment of the present invention includes: a shelf part 140 suppo...

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Abstract

The invention discloses a method for inspecting a substrate. The method comprises the following steps: sequentially casting the pattern beams upon a substrate formed with target object by utilizing a plurality of projecting portions, thus to obtain the phase data of each projection portion related to the substrate; obtaining the height data of each projection portion related to the substrate by utilizing the phase data of each projection portion; compensating the slope of the height data by utilizing the height data of each projection portion; correcting the height data of each projection portion that have received slope compensation; and integrating the height data by utilizing the corrected height data.

Description

technical field [0001] The present invention relates to a method of inspecting a substrate, and more particularly, to a method of inspecting a substrate capable of improving process reliability of inspecting a state of a target formed on a substrate. Background technique [0002] Generally, before and after electronic devices are mounted on a substrate, inspection processing needs to be performed to inspect the reliability of the electronic device-mounted substrate. For example, inspecting the solder joint area of ​​the substrate before mounting the electronic device on the substrate in order to inspect the state of the solder used to mount the electronic device on the substrate, and inspecting the state of the electronic device after mounting the electronic device on the substrate, to verify that the electronics are installed properly. [0003] Recently, a method of inspecting a substrate for inspecting a three-dimensional shape of a target (object) using a device for insp...

Claims

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Application Information

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IPC IPC(8): G01B11/02G01B11/25
CPCG01B11/0625G01B11/30G06T1/0007H05K13/08
Inventor 金熙泰金珉永
Owner 株式会社高迎科技