Novel size reducible ultrahigh frequency_radio frequency identification (UHF_RFID) anti-metal tag and antenna
An anti-metal tag and antenna technology, applied in the field of RFID (Radio Frequency Identification) tags, can solve the problems of inability to reduce the size of the antenna, affecting the size of the tag, and achieve the effect of reducing size, good electrical performance, and convenient installation.
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Embodiment 1
[0018] see figure 1 , which is a schematic side view of a new type of UHF_RFID anti-metal tag with reduced size, including an antenna and an IC chip 14, the antenna further includes a dielectric substrate 11, and a ground layer 13 is provided on one side of the dielectric substrate 11, which corresponds to The radiation electrode layer 12 is arranged on the surface, and the radiation electrode layer 12 is connected to the RF port of the IC chip 14 through the first feeder, and the ground layer 13 is connected to the GND port of the IC chip 14 directly or through the second feeder. At least one conductive metal strip 15 is arranged between the electrode layer 12 and the ground layer 13 , and the radiation electrode layer 12 is connected to the ground layer 13 through the metal strip 15 .
[0019] The conductive metal strip 15 can be made of metal, which can achieve the effect of connecting the radiation electrode layer 12 and the ground layer 13 . The conductive metal strip 15 ...
Embodiment 2
[0029]Conductive metal strips are replaced with inductors. In fact, the Q value of the inductor is relatively low, and its loss value is larger than that of the conductive metal strip. Although the realization effect of the conductive metal strip is better than that of the inductor, the inductor can also be realized.
[0030] A novel size-reduced UHF_RFID anti-metal tag includes an antenna and an IC chip. The antenna further includes a dielectric substrate. A ground layer is provided on one side of the dielectric substrate, and a radiation electrode layer is provided on the corresponding surface. The radiation electrode layer The first feeder is connected to the RF port of the IC chip, the ground layer is connected to the GND port of the IC chip through a section of metal layer or directly through the second feeder, at least one inductor is arranged between the radiation electrode layer and the ground layer, through The inductor connects the radiation electrode layer to the gr...
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