Redundant metal filling method and integrated circuit layout structure
A redundant metal and filling method technology, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of large capacitance increments, etc., and achieve the effects of small calculation burden, increased calculation burden, and reduced filling quantity
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] Secondly, the present invention is described in detail in conjunction with the schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of illustration, the schematic diagrams of the interconnection lines and filling metals in the schematic diagrams will not be partially enlarged according to the general scale, and the schematic diagrams are only examples , which shall not limit the protection scope of t...
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