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Light-emitting diode module which is used for improving radiating efficiency and is provided with upright chip

A technology of light-emitting diodes and chips, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of insufficient heat dissipation efficiency, affecting LED performance and service life, and difficult heat dissipation, so as to improve heat dissipation effect, wide light range, and ensure performance effect

Inactive Publication Date: 2012-07-04
昆山旭扬电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the heat dissipation efficiency of the LED structure is insufficient, it is easy to affect the performance and service life of the LED, especially when multiple LEDs are assembled into a light emitting diode module, it is not easy to dissipate heat

Method used

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  • Light-emitting diode module which is used for improving radiating efficiency and is provided with upright chip
  • Light-emitting diode module which is used for improving radiating efficiency and is provided with upright chip

Examples

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Embodiment Construction

[0017] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0018] In the figures, structurally similar units are denoted by the same reference numerals.

[0019] Please refer to figure 1 , which shows a schematic cross-sectional view of an LED module according to an embodiment of the present invention. The light emitting diode module of the present invention includes a conductive frame 100 , a light emitting diode chip 200 , a top heat absorbing component 300 , a bottom heat absorbing component 400 and an opt...

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Abstract

The invention provides a light-emitting diode module which is used for improving radiating efficiency and is provided with an upright chip. The light-emitting diode module comprises a lead frame, a top heat absorption assembly, a light-emitting diode chip and a bottom heat absorption assembly, wherein the top heat absorption assembly is subjected to hot joint on the lead frame and is provided with a recess, so that part of the lead frame is exposed; the light-emitting diode chip is arranged on the lead frame vertically and is positioned in the recess of the top heat absorption assembly; and the bottom heat absorption assembly is subjected to the hot joint at the bottom of the lead frame. By the light-emitting diode module, a radiating effect can be improved, and luminous quantity can be increased.

Description

【Technical field】 [0001] The invention relates to a light emitting diode (Light Emitting Diode, LED) module, in particular to a light emitting diode module with vertical chips for improving heat dissipation efficiency. 【Background technique】 [0002] Light-emitting diode (LED) has the characteristics of low working voltage, low power consumption, high luminous efficiency, short reaction time, pure light color, firm structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small size and low cost. . With the advancement of technology, the brightness level that LED can display is getting higher and higher, and its application fields are becoming more and more extensive, such as: large-area graphic display full-color screen, status indication, sign lighting, signal display, backlight of liquid crystal display or interior lighting. [0003] Existing LED bases are manufactured by combining metal lead frames with plastic injection molding...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/64H01L25/075
Inventor 林翊轩
Owner 昆山旭扬电子材料有限公司
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