Unlock instant, AI-driven research and patent intelligence for your innovation.

A high-speed printed circuit board

A printed circuit board, high-speed technology, applied in the direction of printed circuit components, etc., can solve the problems of different signal transmission speeds, bit errors, etc.

Active Publication Date: 2016-08-03
HONOR DEVICE CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Differential high-speed signal lines are usually arranged on the printed circuit board. The inconsistency of the dielectric constant of the printed circuit board under the signal line will lead to different transmission speeds of the signals on the two differential lines, which will cause bit errors.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high-speed printed circuit board
  • A high-speed printed circuit board
  • A high-speed printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, the embodiment of the present invention provides a high-speed printed circuit board, including:

[0024] Conductor layer 1, resin layer 2 and reinforcement material layer 3, resin layer 2 is located between conductor layer 1 and reinforcement material layer 3;

[0025] The conductor layer 1 is used as a medium for high-speed printed circuit board transmission signals; the resin layer 2 is used as an insulating material for the high-speed printed circuit board;

[0026] The reinforcing material layer 3 is used to reduce the thermal expansion coefficient of the high-speed printed circuit board, and the reinforcing material layer 3 is a planar structure with uniform thickness.

[0027] Wherein, in this embodiment, the reinforcing material layer 3 is a planar structure with uniform thickness, so that the dielectric of each point of the reinforcing material layer 3 is always consistent; in addition, the thickness of the resin layer 2 is also unifo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-speed printed circuit board, which belongs to the communication field. The high-speed printed circuit board includes: a conductor layer, a resin layer and a reinforcing material layer, and the resin layer is located between the conductor layer and the reinforcing material layer; the conductor layer is used for transmission as a high-speed printed circuit board The medium of the signal; the resin layer is used as the insulating material of the high-speed printed circuit board; the reinforcing material layer is used to reduce the thermal expansion coefficient of the high-speed printed circuit board, and the reinforcing material layer is thick Uniform and consistent planar structure. The invention can make the transmission rates of the two differential lines consistent.

Description

technical field [0001] The invention relates to the communication field, in particular to a high-speed printed circuit board. Background technique [0002] In the field of communication, high-speed printed circuit boards are one of the common electronic components, and high-speed signal lines for transmitting high-speed signals are usually arranged on high-speed printed circuit boards. [0003] Existing high-speed printed circuit boards include glass fiber cloth as a reinforcing material layer, and the glass fiber cloth is formed by weaving glass fibers in a warp direction and glass fibers in a weft direction. The dielectric constants of the overlapping areas of the glass fibers, the gaps between the glass fibers, and the ordinary glass fiber areas are different from each other, resulting in the different dielectric constants of the printed circuit board. Differential high-speed signal lines are usually arranged on the printed circuit board. The inconsistency of the dielect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
Inventor 宗晅周熙熙
Owner HONOR DEVICE CO LTD