Copper dissolving resisting stannum-copper lead-free brazing filler metal alloy

A lead-free solder, tin-copper technology, used in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem of less research work on improving the resistance to dissolution of copper, and the lack of research and quantification of the inhibition of copper dissolution in the solder. Test comparison data, etc.

Inactive Publication Date: 2015-03-11
GUANGDONG PROVINCIAL INST OF WELDING TECH GUANGDONG PROVINCIAL ACADEMY OF UKRAINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In general, there is little research on the improvement of the copper dissolution resistance of SnCu-based lead-free solders, and there is a lack of quantitative experimental comparative data on the research on the copper dissolution inhibition of solders.

Method used

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  • Copper dissolving resisting stannum-copper lead-free brazing filler metal alloy

Examples

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Effect test

Embodiment Construction

[0012] The examples, comparative examples and copper dissolution rates of the present invention are shown in Table 1, and the contents of all elements are percentages by weight.

[0013] Table 1 Examples, comparative examples and copper dissolution rate of anti-dissolving copper-tin-copper lead-free solder alloy

[0014]

[0015] In order to prove the performance of the examples of the present invention in terms of resistance to copper dissolution, the examples and comparative examples were compared under the same test conditions.

[0016] Test method of copper dissolution rate: 【1、2】 The copper wire with a diameter of 1mm is immersed in the solder pool for a certain period of time and then taken out. The diameter change of the copper wire before and after immersion is calculated by referring to the following formula:

[0017] V=1 / 2 (d 0 -d f / t)

[0018] Where V is the dissolution rate of copper; t is the time when the copper wire is immersed in the solder pool, d 0 Is the original dia...

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Abstract

A copper dissolving resisting stannum-copper lead-free brazing filler metal alloy is characterized by being composed of the following elements by weight percentage: 0.1-1% of Cu, 0.01-0.15% of Ge or Zr, 0.01-0.08% of Ni, 0.01-0.7% of In and 0.01-0.3% of RE, and the balance is Sn. The copper dissolving resisting stannum-copper lead-free brazing filler metal alloy is free of harmful metal lead, accords with environment-protection using requirements, has the advantages of being good in copper dissolving resisting performance compared with regular stannum-copper brazing filler metal, and has good application prospect in wave-soldering and hand dip soldering for assembling of consumer electronics manufacturing industries.

Description

Technical field [0001] The invention belongs to an electronic packaging micro-welding solder alloy, and relates to a lead-free solder alloy that is resistant to dissolving copper. Background technique [0002] In recent years, the EU and the Ministry of Information Industry of China have successively passed ROHS Directive and Order No. 39 to control the pollution of electronic information products. The use of lead in electronic packaging micro-welding materials has been strictly restricted. Therefore, lead-free solders are used in consumer electronic products. It is gradually widely used in manufacturing. At present, the mature solders used to replace traditional tin-lead solder are tin-silver-copper, tin-copper and other solders. For consumer electronic products, due to fierce market competition and higher cost control requirements, manufacturers have a strong demand for cheaper tin-copper lead-free solders. [0003] The tin-copper solder represented by Sn0.7Cu has eutectic comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 张宇鹏易江龙许磊杨凯珍房卫萍刘风美刘师田刘正林罗子艺
Owner GUANGDONG PROVINCIAL INST OF WELDING TECH GUANGDONG PROVINCIAL ACADEMY OF UKRAINE
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