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Copper dissolving resisting stannum-copper lead-free brazing filler metal alloy

A lead-free solder, tin-copper technology, applied in the direction of metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problem of less research work on improving the resistance to dissolution of copper, and the lack of quantitative research on the inhibition of solder copper dissolution Test comparison data and other issues

Inactive Publication Date: 2012-07-11
GUANGDONG PROVINCIAL INST OF WELDING TECH GUANGDONG PROVINCIAL ACADEMY OF UKRAINE
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In general, there is little research on the improvement of the copper dissolution resistance of SnCu-based lead-free solders, and there is a lack of quantitative experimental comparative data on the research on the copper dissolution inhibition of solders.

Method used

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  • Copper dissolving resisting stannum-copper lead-free brazing filler metal alloy

Examples

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Effect test

Embodiment Construction

[0012] Examples of the present invention, comparative examples and copper dissolution rates are shown in Table 1, and the contents of all elements are weight percentages.

[0013] Table 1 Examples, Comparative Examples and Copper Dissolution Rate of Resistant Copper-Sn-Cu Lead-Free Solder Alloy

[0014]

[0015] In order to prove the performance of the examples of the present invention in terms of resistance to copper dissolution, the examples and comparative examples were compared under the same test conditions.

[0016] Test method for copper dissolution rate: 【1、2】 Use the copper wire with a diameter of 1mm to be immersed in the solder pool for a certain period of time and then take it out. Refer to the following formula to calculate the change in diameter of the copper wire before and after immersion:

[0017] V=1 / 2(d 0 -d f / t)

[0018] Among them, V is the copper dissolution rate; t is the time when the copper wire is immersed in the solder pool, d 0 is the origi...

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Abstract

A copper dissolving resisting stannum-copper lead-free brazing filler metal alloy is characterized by being composed of the following elements by weight percentage: 0.1-1% of Cu, 0.01-0.15% of Ge or Zr, 0.01-0.08% of Ni, 0.01-0.7% of In and 0.01-0.3% of RE, and the balance is Sn. The copper dissolving resisting stannum-copper lead-free brazing filler metal alloy is free of harmful metal lead, accords with environment-protection using requirements, has the advantages of being good in copper dissolving resisting performance compared with regular stannum-copper brazing filler metal, and has good application prospect in wave-soldering and hand dip soldering for assembling of consumer electronics manufacturing industries.

Description

technical field [0001] The invention belongs to electronic packaging micro-soldering solder alloy, and relates to a lead-free solder alloy resistant to melting copper. Background technique [0002] In recent years, the European Union and the Ministry of Information Industry of China have successively passed the ROHS Directive and Order No. 39 to control the pollution of electronic information products. The use of lead in electronic packaging micro-soldering materials is strictly restricted. It is gradually widely used in manufacturing. At present, tin-silver-copper series, tin-copper series and other solders are maturely used to replace traditional tin-lead solders. For consumer electronic products, due to fierce market competition and increased cost control requirements, manufacturers have a strong demand for lower-cost tin-copper-based lead-free solders. [0003] The tin-copper solder represented by Sn0.7Cu has eutectic composition, fine structure, short melting range an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 张宇鹏易江龙许磊杨凯珍房卫萍刘风美刘师田刘正林罗子艺
Owner GUANGDONG PROVINCIAL INST OF WELDING TECH GUANGDONG PROVINCIAL ACADEMY OF UKRAINE
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