Device for compacting and snipping resin-based composite prepreg spread layer
A composite material and prepreg technology, which is applied in the field of composite material forming and processing, can solve the problems of reducing the layup quality of composite material components, uncontrollable temperature of an electric iron, low notch efficiency of ordinary scissors, etc., so as to reduce layup vacuuming time, increased speed, reduced dust and fiber effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023] The specific implementation method of the present invention will be described below in conjunction with the accompanying drawings and examples, and the present invention is not limited to the examples.
[0024] Such as figure 1 , figure 2 and image 3 As shown, a device for compacting and notching resin-based composite material prepreg layup of the present invention includes: the support and shell mechanism 1 of the device and the compaction mechanism, heating mechanism and heating mechanism arranged in the support and shell mechanism 1. The notch mechanism, wherein the compacting mechanism includes the first large roller 26 and the second small roller 27, the outer rings of the large roller 26 and the small roller 27 are heat-resistant rubber 4, and the resistance wire heating of the heating mechanism is arranged in the heat-resistant rubber 4 The device 12, the resistance wire heater 12 is arranged in the first large roller 26 and the second small roller 27, the n...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com