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Integrated circuit turnover feeding device for test packaging

A technology for testing packaging and feeding devices, used in conveyors, transportation and packaging, etc., can solve the problems of low efficiency and high labor intensity, and achieve the effects of high efficiency, low labor intensity, and simple and practical structure.

Inactive Publication Date: 2012-07-11
HANGZHOU CHANGCHUAN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of high labor intensity and low efficiency in taking out the integrated circuits installed in the material tube one by one and feeding them on the feeding track of the stepping feeding positioning mechanism, and to provide a low labor intensity , high-efficiency integrated circuit test package flip feeding device

Method used

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  • Integrated circuit turnover feeding device for test packaging
  • Integrated circuit turnover feeding device for test packaging
  • Integrated circuit turnover feeding device for test packaging

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] as attached figure 1 , attached figure 2 Shown: an integrated circuit testing and packaging flip feeding device, including a base, a flip seat and a pressure tube mechanism; the pressure tube mechanism is fixedly connected to the flip seat: the flip seat is hinged to the base; There is an overturning drive mechanism for turning the overturning seat between the seats; the tube pressing mechanism can be driven by a pneumatic mechanism or a hydraulic mechanism or a motor; the overturning drive mechanism can be a mechanical mechanism driven by a pneumatic mechanism or a hydraulic mechanism or a motor mechanism; in this embodiment, the turning drive mechanism is a pneumatic mechanism; the tube crimping mechanism is driven by a pneumatic mechanism.

[0018] The flip seat includes a base plate 2 and a push rod 1; the push rod 1 is connected by two sides to form a sh...

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Abstract

The invention relates to the field of integrated circuit test packaging equipment, in particular to an integrated circuit turnover feeding device for test packaging, which is low in labor intensity and high in efficiency. The integrated circuit turnover feeding device for test packaging comprises a base, a turnover seat and a tube pressing mechanism, the tube pressing mechanism is fixedly connected with the turnover seat which is hinged to the base, and a turnover driving mechanism for rotating the turnover seat is arranged between the base and the turnover seat. When the integrated circuit turnover feeding device for test packaging is used, one end of a horizontal tube filled with an integrated circuit is fixedly inserted into the tube pressing mechanism, the turnover driving mechanism drives the turnover seat to turn over backward so that the tube is inclined, one end of the tube is positioned at a supply rail position of a stepping supply positioning mechanism of a test packaging machine, and the integrated circuit filled in the tube falls into the test packaging machine for test packaging under the action of gravity. The integrated circuit turnover feeding device for test packaging is low in labor intensity and high in efficiency.

Description

technical field [0001] The invention relates to the field of integrated circuit testing and packaging equipment, in particular to a flip feeding device for integrated circuit testing and packaging with low labor intensity and high efficiency. Background technique [0002] Integrated circuits before testing and encapsulation are generally installed in special material tubes in order to facilitate transportation and avoid damage; The integrated circuits loaded in the material tube are placed on the feeding track of the stepping feeding positioning mechanism and sent to the test packaging machine for testing and packaging; the integrated circuits installed in the material tube are taken out one by one and placed in the stepping feeding positioning mechanism Feeding on the feeding track has the disadvantages of high labor intensity and low efficiency. Therefore, it is an urgent problem to design a flip feeding device for integrated circuit testing and packaging with low labor in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G25/12
Inventor 韩笑叶键波王维吴胜
Owner HANGZHOU CHANGCHUAN TECH CO LTD
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