Edging width detection method

Abstract

The invention discloses an edging width detection method which comprises the following steps of: exposing a section of preset distance in a scribing slot at the edge of a wafer, wherein exposed patterns are a plurality of identical align marks with equal radical spaces, and each align mark includes periodical repeated figures; recording the length of one align mark, the space between the adjacent align marks, the length of one repeated figure in the align mark and the space between the adjacent repeated figures; developing the wafer to reveal part of the align marks; computing the distance from the starting position of exposure to the edge of edging wafer in the radical direction, wherein the distance is called the length of the revealed align mark; and the difference of the preset distance and the length of the revealed align mark is the edging width. The invention also provides another edging width detection method. According to the methods provided in the invention, the edging width of the wafer edge can be accurately detected, and the application range is not limited.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, and more specifically, to a method for detecting edge-cutting width. Background technique [0002] In the manufacturing process of semiconductor devices, due to the limitation of process technology, the edge of the wafer is often a place with high defects. In order to improve the yield of products, it is necessary to lithography the edge of the wafer with a specific width that may cause defects after spin-coating photoresist. Glue removed. [0003] There are two ways to remove the photoresist with a specific width at the edge of the wafer. One is the EBR (Edge Bead Removal, remove the edge ring) method: after the photoresist is spin-coated, the photoresist flows to the edge of the wafer under the action of centrifugal force or On the back side, after drying, these photoresists are easy to peel off and produce particles, which become the source of defects or failures i...

AI Technical Summary

Problems solved by technology

This method is due to the fact that the ruler is suspended in the air, and the second is due to visual inspection, so the measurement results are very inaccurate

Second, use a microscope with a graduated eyepiece for measurement. This method is also to read the edge width manually, so the measured edge width has an error of at least 0.5mm, compared with the general accuracy requirement of 0.1mm. Said that the results obtained by this method are not accurate enough; and the cost of the microscope with scale in the eyepiece is high, and the scope of use is limited

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