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Electronic component, electronic device, and method of manufacturing the electronic component
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A technology for electronic components and manufacturing methods, which is applied to electrical components, electrical solid-state devices, steering sensing equipment, etc.
Active Publication Date: 2015-04-15
SEIKO EPSON CORP
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Abstract
Description
Claims
Application Information
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Problems solved by technology
As a result, the above-mentioned gyro sensor has the problem that the thickness of the sensor device increases, resulting in a thicker overall thickness.
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no. 1 Embodiment approach
[0041] figure 1 The electronic component according to this embodiment is illustrated, wherein (a) is a plan view, and (b) is a view (side view) in the arrow direction when viewed from the arrow mark P direction in the illustration. In addition, for ease of understanding, the figure 1 (a) shows a cover 60 to be described later, figure 1 (b) The middle cover 60 is drawn by an imaginary line (two-dot chain line).
[0042] Such as figure 1 As shown, the electronic component 100 according to this embodiment will be described by exemplifying gyro sensor elements (hereinafter referred to as gyro vibration elements 11 , 12 , and 13 ) as the vibration elements 11 , 12 , and 13 . Although detailed description will be described later, the gyro vibrating elements 11, 12, 13 are fixed to the semiconductor element 21, 22, 23, wherein the plurality of connection pads 21b, 22b, 23b are provided on the active surfaces 21a, 22a, 23a which are the first surfaces of the semiconductor elements...
no. 2 Embodiment approach
[0063]As a second embodiment, a method for manufacturing the electronic component 100 according to the first embodiment will be described. Figure 4 A manufacturing flow chart according to this embodiment is shown in the figure.
[0064] First, the semiconductor elements 21 , 22 , and 23 and the gyro vibrating elements 11 , 12 , and 13 constituting the electronic component 100 according to the above-described embodiment are prepared ( S1 ). In step S1, semiconductor elements 21, 22, 23 are prepared in which connection pads 21b, 22b, 23b for connecting gyro vibrating elements 11, 12, 13 are formed on active surfaces 21a, 22a, 23a. , And connect the external connection terminals 21c, 22c, 23c of FPC51, 52, 53. These connection pads 21b, 22b, and 23b and external connection terminals 21c, 22c, and 23c include protruding electrodes formed in a convex shape by, for example, metal bumps or solder paste.
[0065] The gyro vibrating elements 11 , 12 , and 13 are formed of, for examp...
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Abstract
An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected. At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface.
Description
technical field [0001] The present invention relates to an electronic component, an electronic device, and a method for manufacturing the electronic component. Background technique [0002] In recent years, a sensor device having a sensor element and a function of driving the sensor element has been known as an electronic component using a piezoelectric element. For example, Patent Document 1 discloses a gyro sensor (piezoelectric oscillator) in which a sensor device is accommodated in a package. The sensor device includes a gyro vibrating piece as a sensor element and a semiconductor device ( Hereinafter, it is referred to as a semiconductor substrate). [0003] In this structure, the semiconductor substrate is fixed on the support substrate, and is electrically connected to the lead wiring portion formed on the support substrate. In addition, the sensor element (gyro vibrating piece) is connected to the lead wire fixed on the support substrate, and is arranged so as to o...
Claims
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Application Information
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