Sensor injection-moulding technology

Abstract

The invention discloses a sensor injection-moulding technology. A secondary injection-moulding method is adopted; in the first injection moulding, a sensor electronic element is coated by a thermosetting material; and in the second injection moulding, the semi-finished product obtained from the first injection moulding is subjected to second injection moulding by using a thermoplastic material. A secondary injection-moulding technology combining the thermosetting material with the thermoplastic material is utilized, and the sensor electronic element is coated by the thermosetting material, so that the purpose of protecting a PCB (printed circuit board) and the electronic element is achieved; the thermoplastic material is used for conducting second injection moulding, so that the purposes of coating the thermosetting material and meeting the appearance requirement are achieved, the usage amount of moulds can be reduced and the cost is lowered.

Description

technical field [0001] The invention belongs to the field of sensor packaging, in particular to an injection molding process of a sensor. Background technique [0002] Thermoplastic materials are easy to form, simple in molds, low in cost, recyclable, and environmentally friendly, but they are not heat-resistant, wear-resistant, and flame-retardant; thermosetting materials are just the opposite of thermoplastic materials, difficult to form, complex in molds, and high in cost , non-recyclable, not environmentally friendly, but high temperature resistance, wear resistance, flame retardant, and corrosion resistance. At present, widely used sensors need to be sealed and packaged to achieve the purpose of protection and shaping. Ordinary sensors are molded by filling glue or a single thermoplastic material. For example, the domestic patent CN01144240, a sealed sensor technology, adopts It is a kind of glue filling process, but the glue filling process is easy to have air bubbles...

AI Technical Summary

Problems solved by technology

[0002] Thermoplastic materials are easy to form, simple in molds, low in cost, recyclable, and environmentally friendly, but they are not heat-resistant, wear-resistant, and flame-retardant; thermosetting materials are just the opposite of thermoplastic materials, difficult to form, complex in molds, and high in cost , non-recyclable, not environmentally friendly, but high temperature resistance, wear resistance, flame retardant, and corrosion resistance

At present, widely used sensors need to be sealed and packaged to achieve the purpose of protection and shaping. Ordinary sensors are molded by filling glue or a single thermoplastic material. For example, the domestic patent CN01144240, a sealed sensor technology, adopts It is a kind of glue filling process, but the production of glue filling process is easy to have air bubbles and cracks, and the cost is high, the process is complicated, and the quality is not guaranteed; and the use of a single thermoplastic material often has different defects of the material itself. More molds, higher cost