Semiconductor wafer liquid-spraying etching system and method

Abstract

The invention relates to a liquid-spraying etching system and method of a semiconductor wafer. The semiconductor wafer liquid-spraying etching system comprises a carrying-platform device and a spraying device, wherein the carrying-platform device is used for fixing the semiconductor wafer when the surface to be etched of the semiconductor wafer faces downwards, and controlling rotation of the semiconductor wafer; the spraying device is placed below the carrying-platform device and comprises a plurality of spraying nozzles and a plurality of controlling pieces; all the spraying nozzles are used for spraying etching liquid on the corresponding positions of the surface to be etched on the semiconductor wafer upwards; the plurality of controlling pieces correspond to the plurality of spraying nozzles; and each controlling piece is used for controlling the spraying flow rate of the etching liquid of the spraying nozzle corresponding to the control piece. The liquid-spraying etching system and method have good etching uniformity and can improve the quality of products.

Description

technical field [0001] The invention relates to a semiconductor wafer etching system and method, in particular to a semiconductor wafer liquid jet etching system and method. Background technique [0002] In the chip manufacturing process, an etching process is required to remove a certain material, such as photoresist, from the surface of the wafer. One method of the etching process is to use an etching solution on the surface of the wafer to remove the material on the surface of the wafer. . refer to figure 1 and figure 2 The traditional way of this method is to fix the wafer 11 on the processing table 15, the nozzle 13 above the wafer 11 sprays the etching liquid downward, and the centrifugal force generated by the rotating wafer 11 diffuses the etching liquid outward. [0003] This approach poses a problem of poor etch uniformity, for example, in figure 1 Among them, the surface of the wafer 11 is usually not completely smooth, but has certain unevenness. When the et...

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Problems solved by technology

[0003] This approach poses a problem of poor etch uniformity, for example, in figure 1 Among them, the surface of the wafer 11 is usually not completely smooth, but has certain unevenness. When the etchant is sprayed onto the surface of the wafer 11, the dosage of the concave and the convex is different, resulting in uneven etching, and the etching is close to the spraying. The position of the point is etched severely

another example figure 2 As shown, when there is pattern bump 17 on the wafer 11, since there is more etching liquid near the injection point position, the bump closer to the injection point is likely to cause serious chamfering (i.e. near-cutting angle) 19, which affects the chip. Processing quality

[0004] Moreover, when etching different wafers or different positions of wafers, it is necessary to constantly adjust the position of the nozzle, which is cumbersome and cannot be adjusted in time as needed

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