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Base plate processing device and base plate processing system

A substrate processing device and a technology for substrates, which are applied in data processing applications, instruments, electrical components, etc., can solve problems such as damaged marking information and bad marking information, and achieve the effect of suppressing the increase of total time.

Active Publication Date: 2014-11-12
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the component mounting machine (substrate processing apparatus) described in the above-mentioned Patent Document 1, there is damage flag information (defective flag information ), it is necessary to install dedicated equipment such as IC tag readers and IC tag writers

Method used

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  • Base plate processing device and base plate processing system
  • Base plate processing device and base plate processing system
  • Base plate processing device and base plate processing system

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0036] First, refer to Figure 1 to Figure 3 , the configuration of the substrate processing system 1 including the mounter 10 according to the first embodiment of the present invention will be described. In addition, the mounter 10 is an example of the "substrate processing apparatus" of this invention.

[0037] Such as figure 1 As shown, the substrate processing system 1 includes a printing machine 2 , an inspection machine 3 and a mounting machine 10 . This substrate processing system 1 mounts components (electronic components such as ICs, transistors, capacitors, and resistors) on each of a plurality of printed circuit boards (multi-piece spliced ​​substrates 50 ) conveyed on the substrate conveyance path 4 . system. Here, the multi-joint substrate 50 refers to a printed circuit board formed by combining two or more printed circuit boards (single substrate 50 a ) on which one or more types of electronic circuits are formed. The above-mentioned multi-piece laminated sub...

Embodiment approach

[0095] For the first embodiment, the controller 19 is provided as described above, based on the 9 pieces indicating whether each of the 5 multi-piece spliced ​​substrates 50 (workpieces 1 to 5) has nine Each of the individual substrates 50a is attached with damage mark information (damage mark information table 60) of the damage mark BM, and the photographing sequence of the nine individual substrates 50a is controlled so that the substrate recognition camera 13b can easily determine the processing object Nine individual substrates 50a included in the multi-joined substrate 50 to be processed are photographed in order of which of the five multi-joined substrates 50 is the multi-joined substrate 50 . Thus, since the imaging order of the nine individual substrates 50a included in the multi-joined substrate 50 to be processed is set so that it is easy to determine the order of the multi-joined substrates 50 to be processed, even if the substrate recognition camera 13b is not used ...

no. 2 approach

[0103] Next, refer to figure 1 , figure 2 , Figure 4 , Figure 5 and Figure 9 to Figure 12 , the mounting machine 20 according to the second embodiment of the present invention will be described. In the second embodiment, unlike the above-mentioned first embodiment in which the identification process of the damage mark BM is performed on all nine single-piece substrates 50a at the stage before the multi-piece spliced ​​substrate 50 is carried into the mounting machine 10, for the multi-piece spliced ​​substrate A description will be given of an example in which the recognition process of the damage mark BM is performed on only six individual substrates 50 a among the nine individual substrates 50 a in the stage before 50 is carried into the mounting machine 20 . In addition, the mounter 20 is an example of the "substrate processing apparatus" of this invention.

[0104] Such as figure 1 As shown, for the second embodiment, a substrate processing system 1 a includes a ...

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Abstract

The invention provides a base plate processing device and a base plate processing system. An assembling machine (10) (the base plate processing device) restrains the increase of total time necessary for executing designated processing on a base plate of an object to be processed and determines bad mark information of each vice base plates possessed by the base plate of an object to be processed by no means of special equipment. The assembling machine (10) comprises a base plate recognition camera (13b) and a controller (19); based on damage mark information representing whether to provide a damage mark (BM) for single sheet base plates (50a), the controller (19) makes the base plate recognition camera (13b) control shooting order by a way of shooting the single sheet base plates (50a) according to multichip splicing base plates (50) which are easy to determine objects to be processed, and accordingly the multichip splicing base plates (50) of objects to be processed are determined and the damage mark information of the multichip splicing base plates (50) of objects to be processed are determined.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing system, and more particularly to a substrate processing apparatus and a substrate processing system that perform a predetermined process on each of a plurality of substrates each having a plurality of sub-substrates. Background technique [0002] Conventionally, there is known a substrate processing apparatus that performs predetermined processes such as printing of solder and mounting of electronic components on each of a plurality of substrates each having a plurality of sub-substrates. [0003] Generally speaking, when using a substrate processing apparatus to perform a predetermined process on a plurality of substrates, each of the plurality of sub-substrates included in each of the plurality of substrates may be attached with a sign indicating that the sub-substrate is defective. bad marks (damaged marks). In this case, the conventional substrate processi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCG06Q50/04H05K13/0406H05K13/0895
Inventor 西城洋志小林宽
Owner YAMAHA MOTOR CO LTD