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Arc ion plating device

An arc ion plating and magnetic flux density technology, which is applied in ion implantation plating, sputtering plating, vacuum evaporation plating, etc., can solve the problem of difficulty in reducing residual stress, etc. The effect of improving smoothness

Active Publication Date: 2015-07-22
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At this time, it is considered that the bias voltage applied to the workpiece can be reduced, but since the magnetic force is large, it is difficult to reduce the residual stress even if the bias voltage is reduced

Method used

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Embodiment

[0060] Examples performed to confirm the effects of the present invention will be described.

[0061] TiAl (Ti:Al=50:50) having a diameter of 100 mm and a thickness of 16 mm was used as an evaporation source.

[0062] In addition, a set of ring magnets outside the evaporation source and a central magnet on the back of the evaporation source are permanent neodymium magnets, the coercive force is 2000kA / m, and the surface magnetic flux density is 1150mT. As a comparative example, one ring magnet and a neodymium magnet were provided outside the evaporation source, the coercive force was set to 2000 kA / m, and the surface magnetic flux density was set to 1150 mT. The magnet at the center of the back surface of the evaporation source was a ferrite magnet, the coercive force was 250 kA / m, and the surface magnetic flux density was 350 mT.

[0063] When an evaporation source is arranged in an arc ion plating device equipped with such a magnet, and the magnetic field on the evaporation...

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Abstract

The invention provides an arc ion plating device, which can prevent arc spots from entering into places other than the surface part of evaporation source, conduct stable discharging and improve surface smoothness and forms a thin film with quite high control performance of left stress. The magnetic flux density of the inner side area surface which excludes the area from the end face to the other end with predetermined width is 10-15mT. The magnetic flux density of the end part area surface is 3mT larger than that of the inner side area surface. The distance from the surface of the evaporation source to workpiece is 120-300mm. The accumulated value of absolute value of the magnetic flux density is below 260mT.mm. The angle Theta between the magnetic line of force on the evaporation surface and the normal of the evaporation surface is 0-20 DEG, and the angle inclines from the end part area surface to the inner side area. The standard deviation of the magnetic flux density of the inner side area is below 3.

Description

technical field [0001] The invention relates to an arc ion plating device which ionizes an evaporation source by arc discharge and forms a film on a workpiece. Background technique [0002] The arc ion plating device is a device that uses the evaporation source of a metal material or a ceramic material as a cathode (negative electrode) in a vacuum to generate an arc discharge, thereby evaporating the evaporation source and releasing it as ions. Coatings) apply a negative bias voltage, and accelerate the supply of ions to the surface of the workpiece to form a film. Titanium and chromium are widely used as evaporation sources, and are used in techniques for forming hard coatings such as Ti, TiAl, and CrAl on the surface of cutting tools made of high-speed steel, cemented carbide, and cermets, for example, to improve wear resistance. [0003] In such an arc ion plating apparatus, the arc current is concentrated on a minute region on the surface of the evaporation source, wher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/32
Inventor 仙北屋和明田中裕介
Owner MITSUBISHI MATERIALS CORP
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