Miniature intelligent label

Abstract

The invention discloses a miniature intelligent label which is formed by a substrate, a chip and a package body. The substrate is square and is composed of a layer of thin insulating medium, a conductive pattern arranged at front and back faces of the insulating medium, a solder mask layer arranged at the front and back faces of the insulating medium and a surface of the conductive pattern, and a metallization hole which connects front conductive layer and back conductive layer. The chip is a dedicated chip of the intelligent label and is arranged at a part surface center area. The package body is formed by square resin molding material. The package body is arranged at an upper part of a substrate part surface, packages the chip and combines with the substrate to form a cuboid structure. The working frequency of the intelligent label is 13.56MHz, and by employing precision etching process, wire-to-wire capacitance between antenna adjacent windings and a plate capacitance resonant matching principle of front and back antenna windings, the packaging of a small intelligent label is realized.

Description

technical field [0001] The invention relates to the field of radio frequency communication and the field of smart labels, in particular to a miniature smart label. Background technique [0002] In recent years, due to the continuous development of radio frequency electronic technology, especially the wide application of radio frequency electronic tags, people's way of life is gradually changing. Common radio frequency electronic tags are divided into two categories: active and passive in terms of power supply; in terms of carrier frequency, there are 125KHz (130KHz) low-frequency bands, 13.56MHz high-frequency bands, 433MHz, 915MHz ultra-high frequency bands , 2.4GHz, 5.8GHz microwave frequency band; the application of electronic tags is ubiquitous, so there are various shapes and products suitable for different application requirements, making people's life more convenient and efficient. [0003] In order to make radio frequency electronic tags more widely used in dail...

AI Technical Summary

Problems solved by technology

During the surface mount process, it is easy to contaminate the solder to the chip pad, and the high-temperature baking process of reflow soldering will cause oxidative denaturation of the coating on the surface of the substrate and changes in the physical size of the substrate, especially the deformation of the substrate, which will easily affect subsequent production process, resulting in a decline in product quality

Increased capacitors and surface mount technology will increase the cost, reduce the cost performance of the product, and affect the overall competitiveness of the product

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