Tripropargyl isocyanuric ester polymer and preparation method thereof

A technology of tripropargyl isocyanurate and propargyl isocyanurate, which is applied in the field of thermosetting resin and its preparation, can solve the problems of low shrinkage rate, single element, high carbon residue rate, etc., to reduce economic Low cost, good high temperature resistance, simple process

Inactive Publication Date: 2013-11-27
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 4. The elements contained in the molecular structure are relatively single, the pyrolysis carbon residue rate is high, and the shrinkage rate is low

Method used

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  • Tripropargyl isocyanuric ester polymer and preparation method thereof
  • Tripropargyl isocyanuric ester polymer and preparation method thereof
  • Tripropargyl isocyanuric ester polymer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The prepared tripropargyl isocyanurate monomer (refer to the patent document with the patent number ZL201010533489.0 for the preparation method) is subjected to DSC test, and the DSC curve obtained from the test is shown in figure 2 , figure 2 Among them, 166°C is the melting point temperature, 248°C is the curing start temperature, 260°C is the curing peak temperature, and 278°C is the curing end temperature. The melting and solidification temperatures are set accordingly.

Embodiment 2

[0029] Get 243g of the prepared tripropargyl isocyanurate monomer and place it in a porcelain crucible, rise to 166°C at a rate of 10°C / min with a heating rate of 10°C / min in a tube furnace and in this Insulate at the same temperature for 1h, then heat to 248°C at a heating rate of 1°C / min, and keep at this temperature for 2h, then heat at a heating rate of 1°C / min to 260°C, and keep at this temperature 4h, then raised to 278°C at a rate of 1°C / min, kept at this temperature for 1h and then cooled to room temperature.

[0030] The obtained cured resin is characterized by TG for its heat resistance: in N 2 Under the atmosphere, the temperature was raised to 800°C at 10°C / min, and the residual mass of the obtained polymer reached 70%.

Embodiment 3

[0032] Get 243g of the prepared tripropargyl isocyanurate monomer and place it in a porcelain crucible, rise to 168°C at a rate of 15°C / min with a heating rate of 15°C / min in a tube furnace and in this Insulate at the same temperature for 1 hour, then heat to 252°C at a heating rate of 1°C / min, and keep at this temperature for 2 hours, then heat at a heating rate of 1°C / min to 266°C, and keep at this temperature 4h, then raised to 286°C at a rate of 1°C / min, kept at this temperature for 1h and then cooled to room temperature.

[0033] The obtained cured resin is characterized by TG for its heat resistance: in N 2 Under the atmosphere, the temperature was raised to 800°C at 10°C / min, and the residual mass of the obtained polymer reached 75%.

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Abstract

The invention discloses a tripropargyl isocyanuric ester polymer and a preparation method thereof. The tripropargyl isocyanuric ester polymer is a polymer obtained by melting tripropargyl isocyanuric ester serving as a polymerization monomer at the temperature of 160-170 DEG C and curing at the temperature of 245-300 DEG C with a thermal polymerization method; and the initial decomposing temperature of the tripropargyl isocyanuric ester polymer is 370-385 DEG C. A tripropargyl isocyanuric ester polymer material with a high crosslinking degree can be obtained at a low thermal treatment temperature, the polymer has very high temperature resistance, and starts decomposing at the temperature of 370-385 DEG C in an N2 atmosphere, and the carbon yield can be up to 70-75 percent at the temperature of 800 DEG C.

Description

1. Technical field [0001] The invention relates to a thermosetting resin and a preparation method thereof, in particular to a tripropargyl isocyanurate (TPIC) polymer and a preparation method thereof. 2. Background technology [0002] Since the 1950s, the development of high-tech such as aerospace has promoted the research on heat-resistant polymer materials, and many heat-resistant polymers have been applied one after another. Cyanate resin is a new type of resin with excellent performance, which combines heat resistance, toughness and excellent processability. It has been used in multilayer printed circuit boards, high-speed substrates for optoelectronic devices, radome, high Booster antennas, stealth aircraft, structural composites and adhesives, and many other fields. [0003] Alkyne-based resin (ATR) is a new type of high temperature resistant thermosetting resin. Alkyne-based resin refers to terminal alkyne oligomers or terminal alkyne compounds. Under certain condit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G61/12
Inventor 史铁钧陈苏锋杨兆攀
Owner HEFEI UNIV OF TECH
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