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Led module

A technology for LED modules and LED chips, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as peeling off and LED chips 94 not being lit.

Active Publication Date: 2012-09-19
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the encapsulation resin 96 is thermally deformed, and since the epoxy resin and the gold plating layer are not firmly bonded, the encapsulation resin 96 will peel off from the metal electrodes 92 and 93.
If this happens, it may cause the LED chip 94 not to be lit

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

[0041] Figure 1 ~ Figure 3 An LED module based on the first embodiment of the present invention is shown. Figure 1 ~ Figure 3 The illustrated LED module A1 includes a substrate 1 , metal wiring 2 , LED chips 3 , encapsulation resin 4 , wires 5 , and coating members 6 . here, image 3 is to show figure 1 The inside of the LED module A1 is shown, and the plan view of the encapsulating resin 4 is omitted. Figure 1 ~ Figure 3 The x, y, and z directions shown in are mutually perpendicular directions, wherein the z direction is the thickness direction of the substrate 1 . In the instructions below, for figure 2 In the substrate 1 , the surface on the upper side in the z direction is called the front surface, the surface on the lower side is called the back surface, and the surfaces on both ends in the x direction are called side surfaces.

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PUM

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Abstract

A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.

Description

technical field [0001] The present invention relates to an LED module provided with a light emitting diode (hereinafter referred to as LED). Background technique [0002] Figure 10 An example of an LED module is shown. Figure 10 The shown LED module X includes: a substrate 91; metal electrodes 92, 93 provided on the substrate 91; an LED chip 94 connected to the metal electrodes 92, 93; wires 95; The substrate 91 is made of, for example, glass epoxy resin. The metal electrodes 92 , 93 are arranged on two ends of the substrate 91 at intervals, and respectively cover the area from the front through the side to the back of the substrate 91 . An LED chip 94 is mounted on a portion of the metal electrode 92 covering the front surface of the substrate 91 . One end of a wire 95 is fixed to a portion of the metal electrode 93 covering the front surface of the substrate 91 . The other end of the wire 95 is connected to the LED chip 94 . The LED chip X is provided in, for example...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L33/60H01L2224/48091H01L33/52H01L2224/48465H01L2224/48227H01L33/62H01L33/486H01L33/56H01L2924/3011H01L2224/45144H01L2924/00014H01L2924/00H01L2224/05599H01L2224/85399H01L33/54H01L24/48
Inventor 小早川正彦
Owner ROHM CO LTD