Method for manufacturing blind slot of circuit board
A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, metal core circuit manufacturing, printed circuit, etc., can solve problems affecting the uniformity of electroplating, difficulty in power amplifier devices, and scrapping, etc.
Inactive Publication Date: 2012-09-19
YIXING SILICON VALLEY ELECTRONICS TECH
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Problems solved by technology
The metallization of blind slots is the decisive process that affects the dimensional accuracy of blind slots. During the metallization process of blind slots, due to the different graphic designs of blind slots and the effect of plating tip effects on the uniformity of plating, it is easy to cause thicker copper plating on slots, resulting in special Some power amplifier devices with size requirements are difficult to install in the slot and become scrapped
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[0018] The technical solution will be further described below in conjunction with the accompanying drawings and embodiments.
[0019] A method for manufacturing a blind groove of a circuit board includes the following steps.
[0020] see figure 1 Firstly, a first substrate 1 and a second substrate 2 are provided, and the first substrate 1 and the second substrate 2 are circuit boards with fabricated circuits. The first substrate 1 and the second substrate 2 may be two-layer boards or multi-layer boards. A first opening 3 is defined on the second substrate 2 .
[0021] see figure 2 A metal block corresponding to the first opening 3 is provided, with a conductive adhesive layer 5 on the metal block. It is also possible to press a layer of conductive material on the metal block, and the conductive material and the metal block are pressed together through the conductive bonding layer. The metal block 4 is pretreated, and the pretreatment includes browning treatment on the me...
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The invention provides a method for manufacturing a blind slot of a circuit board. The manufacturing method comprises the following steps: providing a first substrate and a second substrate, wherein the first substrate and the second substrate form the circuit board with a manufactured circuit; forming a first opening on the second substrate; providing a metal block corresponding to the first opening, and arranging a conductive bonding layer on the metal block; providing a prepreg, wherein the prepreg comprises a first open window corresponding to the first opening; embedding the metal block into the first opening; and sequentially stacking the second substrate, the prepreg and the first substrate, and pressing to enable the second substrate, the prepreg and the first substrate to become a whole. Depth-control milling is adopted for enabling the circuit board after pressing to form the blind slot in a region corresponding to the first opening. According to the manufacturing method disclosed by the invention, the electrical properties and the heat radiation performance requirements of the blind slot can be also realized without performing electroplating on the blind slot; and in addition, the problem of the point effect of a rabbet caused by the electroplating is also solved, and the depth-control manufacturing of the blind slot, which meets the ultra-high-precision dimensional requirements, can be realized.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a blind groove of a circuit board. Background technique [0002] The installation density of electronic equipment continues to increase, and the functions continue to improve and shrink, resulting in higher and higher heat density of PCB boards. For some power amplifier high-frequency communication products, it is impossible to dissipate enough heat simply by packaging design. The PCB is designed to enhance the heat dissipation effect. In this case, the large copper block blind burying technology has been effectively applied. The large copper block blind burying technology is to first embed the copper block in the designated lamination area by lamination, and then realize the electrical connection performance and heat dissipation performance of the blind slot by controlling the depth of the blind slot and metallization. [0003] Since power amplifier devi...
Claims
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IPC IPC(8): H05K3/00H05K3/44
Inventor 陈黎阳乔书晓蒋岳
Owner YIXING SILICON VALLEY ELECTRONICS TECH