Apparatus for forming coating film and method for forming coating film

Abstract

The invention provides a coating film forming apparatus and a coating film forming method. Through the application of two nozzles, the production time of a coating process is reduced, and cost is minimized. The coating film forming apparatus comprises the components as following: a nozzle mataining member (12) which maintaining a first nozzle (16) and a second nozzle (17) which arranged at the conveying direction of the substrate back and forth; a nozzle moving member (11), which enables the nozzle maintaining member to move along the conveying direction of the substrate; a control member (40), which controls the first and the second nozzles, the nozzle moving member is controlled to arrange the first and second nozzles at the same coating position on the conveying direction of the substrate, and the nozzle maintaining member is moved by the control on the nozzle moving member, and any one of the first and second nozzles is used for ejecting process liquid to the substrate.

Description

technical field [0001] The present invention relates to a coating film forming device and a coating film forming method for coating a substrate with a treatment liquid. Background technique [0002] For example, in the manufacturing process of an FPD (Flat Panel Display: FLATPANEL DISPLAY), a circuit pattern is formed using a so-called photolithography process. [0003] In this photolithography process, after forming a predetermined film on a substrate such as a glass substrate, a photoresist (hereinafter referred to as a resist) as a processing liquid is applied to form a resist film (photosensitive film). Then, the above-mentioned resist film is exposed according to the circuit pattern, and the resist film is developed to form a pattern. [0004] However, in recent years, in the formation process of the resist film in this photolithography process, for the purpose of improving throughput (throughput), a method of processing the substrate while transporting the substrate i...

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Problems solved by technology

[0028] But when Figure 8 In the structure of the coating film forming apparatus 300 shown, the coating positions of the two nozzles 303 and 304 coating the substrate G are different, so the drying state at the time of delivery from the floating stage 301 varies. The problem

[0029] In addition, in the coating processing part 301B, since it is necessary to secure an area for coating processing by each nozzle 303, 304, the overall length of the floating stage 301 becomes longer, and since each nozzle 303, 304 needs to be activated Filling processing units 305, 306, substrate detection sensors, etc., so there is a problem of cost increase

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