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Magnetic field generator, magnetron cathode, and sputtering device

A magnetron cathode and generating device technology is applied in the sputtering technology field of the magnetron sputtering method to achieve the effects of improving the utilization rate and the strength of the magnetic field

Active Publication Date: 2014-02-26
SHINCRON KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, in the existing structure, the utilization rate of the target is only about 15 to 20%, which will cause problems when using high-priced target materials for film formation

Method used

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  • Magnetic field generator, magnetron cathode, and sputtering device
  • Magnetic field generator, magnetron cathode, and sputtering device
  • Magnetic field generator, magnetron cathode, and sputtering device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] One embodiment of the above invention will be described below with reference to the drawings.

[0032] "Sputtering Device"

[0033] First, a sputtering apparatus that performs magnetron sputtering as an example of sputtering will be described.

[0034] Such as figure 1 As shown, a sputtering apparatus 1 according to one embodiment of the present invention includes a vacuum chamber 2 capable of evacuating the inside. A substrate holder 4 for holding a film-forming target object 5 facing downward is provided at an upper portion inside the vacuum chamber 2 . In sputtering film formation, the film formation object 5 held as the substrate holder 4 is, for example, a glass substrate, a plastic substrate, or the like. In addition, a pump for evacuation, a gas introduction unit (both are not shown in the drawings), and the like are connected to the vacuum chamber 2 .

[0035] In this embodiment, the lower inner wall portion of the vacuum chamber 2 facing the substrate hold...

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PUM

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Abstract

An object is to heighten a utilization rate of a target. A magnetic field generator 10 arranged behind a target 8 and for generating a magnetic field on a front surface 8a of the target 8 based on magnetic force lines 11 comprises a ring-shaped outer magnetic body 144 having a pole axis in a parallel direction (X-direction) with respect to the target 8 surface, a center magnetic body 142 arranged on an inner side of the outer magnetic body 144 and having a pole axis in a parallel direction (X-direction) with the direction of the pole axis of the outer magnetic body 144, a yoke plate 12 for supporting the outer magnetic body 144 and the center magnetic body 142 from behind, and a magnetic permeable plate 16 for changing a magnetic field distribution of the front surface 8a of the target 8. The magnetic permeable plate 16 is arranged so as to be supported by the yoke plate 12 from behind.

Description

technical field [0001] The present invention relates to a magnetic field generating device, a magnetron cathode and a sputtering device, and is especially suitable for sputtering technology (magnetron sputtering technology) which involves a magnetron sputtering method in which plasma is confined near a target by a magnetic field. tube sputtering). Background technique [0002] Among the sputtering methods, magnetron sputtering in which a magnetic field generating device including a plurality of magnets is arranged on the back surface of a target as an object to be processed is the mainstream of the sputtering method. Magnetron sputtering is a method of forming a magnetic field on the surface of the target through a magnet, and using the drift motion of electrons to confine the plasma near the surface of the target, thereby forming a high-density plasma. Since such high-density plasma exists near the surface of the target, high-speed film formation can be realized. [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C03C17/245C23C14/34
CPCH01J37/3452H01J37/3405H01J25/50C23C14/35H01F7/081H01J37/3461C23C14/351C03C17/245C23C14/34
Inventor 孔为林子敬李明谢斌王海千姜友松长江亦周
Owner SHINCRON KK