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Method for laser scoring and singulation of glass substrates

A substrate and laser beam technology, applied in glass production, glass manufacturing equipment, laser welding equipment, etc., can solve problems such as poor edge features, out-of-control overall segmentation, etc.

Active Publication Date: 2015-11-25
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the score-break technique is used to divide strengthened glass substrates such as ion-exchanged glass, runaway overall division rather than formation of score lines can occur
Runaway segmentation often produces poor edge characteristics compared to score-break processes

Method used

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  • Method for laser scoring and singulation of glass substrates
  • Method for laser scoring and singulation of glass substrates
  • Method for laser scoring and singulation of glass substrates

Examples

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Embodiment Construction

[0027] Reference will now be made in detail to embodiments of forming scribed vents partially through the thickness of a strengthened glass substrate, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. As described herein, methods for forming scribe vents in strengthened glass substrates generally include forming a vertical dimple through a compressively stressed surface layer such that the dimple is offset from a first edge of the strengthened glass substrate. The exposed internal tensile stress layer below the compressive layer of glass facilitates dent initiation during the laser scribing process. The beam spot of the laser source is then directed onto the stressed layer along the desired parting line. The cooling spot formed by the cooling jet is directed onto the pressurized layer such that the cooling spot is located near the trailing edge ...

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Abstract

Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Patent Application Serial No. 12 / 627,172, filed November 30, 2009, entitled "Methods for Scribing and Separating Glass Substrates," and filed April 9, 2010, entitled " Priority to Methods of Forming Scribe Vents in Strengthened Glass Substrates" U.S. Patent Application Serial No. 61 / 322,478, which is hereby incorporated by reference in its entirety. [0003] background [0004] field [0005] The present description relates generally to methods for singulating strengthened glass substrates, and more particularly to methods for forming scribe vents to singulate strengthened glass substrates. technical background [0006] Thin glass substrates have various applications in consumer electronic devices. For example, glass substrates can be used as cover plates for LCD or LED displays included in mobile phones, display devices such as televisions or computer monitors, and various other electroni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/033C03B33/09
CPCC03B33/091B23K26/0736C03B33/033C03B33/082Y02P40/57
Inventor 李兴华
Owner CORNING INC