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LED light module

A technology of light-emitting modules and light-emitting elements, which is applied in the direction of semiconductor devices, light sources, point light sources, etc. of light-emitting elements

Inactive Publication Date: 2012-10-17
骆万宝
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, light emitting devices (with such LEDs as the light emitting element of the device) typically only specify an expected operating life of 35,000 hours

Method used

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  • LED light module
  • LED light module
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Examples

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Embodiment Construction

[0043] The invention will now be described with reference to the accompanying drawings which illustrate various aspects, embodiments or implementations of the invention. In the drawings, for illustrative purposes, some dimensions of structures, parts or elements may be exaggerated relative to the size of other structures, parts or elements to help illustrate and disclose the present invention.

[0044] This application claims priority to U.S. Provisional Patent Application Serial No. 61 / 302,474, filed February 8, 2010, and U.S. Provisional Patent Application Serial No. 61 / 364,567, filed July 7, 2010, and Its entire contents are incorporated by reference. These incorporated provisional applications all include drawings and descriptions, and the drawings and descriptions include figure numbers, element symbols and descriptions corresponding to the figure numbers and element symbols. To avoid confusion and to more clearly discuss the present invention, figure numbers and element...

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Abstract

A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre- aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element.; A robust, healthy 3 -dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.

Description

[0001] Cross references to related applications: [0002] This application claims priority to US Provisional Patent Application Serial No. 61 / 302,474, filed February 8, 2010, the entire disclosure of which is hereby incorporated by reference. This application claims priority to US Provisional Patent Application Serial No. 61 / 364,567, filed July 15, 2010, the entire disclosure of which is hereby incorporated by reference. Applicant claims February 8, 2010 as the earliest priority date. technical field [0003] The present invention relates to light emitting devices. More specifically, the present invention relates to light emitting device modules and lighting equipment. Background technique [0004] Light emitting diodes (LEDs) are generally fabricated using semiconductor materials doped with impurities to establish a P-N junction. When a potential (voltage) is applied to the P-N junction, current flows through the P-N junction. Charge carriers (electrons and holes) flow ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64
CPCF21K9/30F21V29/22F21Y2101/02F21V29/70F21K9/20F21Y2115/10H01L33/62H01L33/64H01L33/48
Inventor 骆万宝
Owner 骆万宝