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Method and system for measuring wafer rotation parameters

A technology for rotating parameters and wafers, applied in measurement devices, measurement acceleration, speed/acceleration/shock measurement, etc., which can solve problems such as spending a lot of time in error evaluation and no wafer rotation speed.

Active Publication Date: 2012-10-24
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, at present, the alignment / offset of the wafer is mostly checked according to the effect of EBR (Edge Bead Removal, edge photoresist removal), which requires a lot of time for repeated error evaluation (review) and fine-tuning; at the same time , there is currently no effective tool for measuring wafer rotation speed

Method used

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  • Method and system for measuring wafer rotation parameters
  • Method and system for measuring wafer rotation parameters
  • Method and system for measuring wafer rotation parameters

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Embodiment Construction

[0041] For a thorough understanding of the present invention, detailed description will be given below.

[0042] It should be noted that although a number of specific details are provided in the following description in order to provide a more thorough understanding of the present invention; however, it will be apparent to those skilled in the art that the present invention may not require one or more of these details And be implemented. Meanwhile, in order to avoid confusion with the gist of the present invention, some technical features known in the art are not described.

[0043] The method for measuring the wafer rotation parameter disclosed in the present invention will be firstly introduced below.

[0044] In a specific embodiment, such as figure 1 As shown, two acceleration sensors are arranged on the wafer, which are respectively the acceleration sensor S0 arranged at the center of the wafer and the acceleration sensor S4 arranged at a specified distance D from the c...

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Abstract

The invention discloses a method and a system for measuring wafer rotation parameters. The method comprises the following steps of: arranging a first acceleration sensor at the center of a wafer, and arranging a second acceleration sensor at a position at a specified distance from the wafer center; establishing a reference coordinate system by using the first acceleration sensor serving as the original point, and determining relative position between the second acceleration sensor and the first acceleration sensor in the reference coordinate system; after the wafer is transmitted to a rotation unit, recording the accelerated speed measured by the first acceleration sensor and the second acceleration sensor; and determining rotation parameters of the wafer according to measured results. By means of the method and the system for measuring the wafer rotation parameters, offset of the wafer center and the wafer rotation speed can be quickly and accurately obtained.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a method and system for measuring rotation parameters of a wafer (Wafer). Background technique [0002] With the continuous improvement of the level of semiconductor integration, the requirements for operational precision in the wafer processing process have also developed from the micron level to the submicron level or even the nanometer level; this requires that accurate wafers need to be obtained during the operation relevant parameters for calibration and further operation. [0003] In particular, in the wafer manufacturing process, a series of operations such as cleaning, etching, and drying are all completed after the wafer is transferred to the rotation unit by the robot arm, so the deviation between the wafer center and the rotation center will be It directly affects the accuracy and efficiency of the entire wafer manufacturing process. At the same time, the contr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/00G01P15/00
Inventor 黄宽信袁德贵薛民胡晓明贾松峰
Owner SEMICON MFG INT (SHANGHAI) CORP
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