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Composite substrate for high-power component

A high-power component and composite technology, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of decreased heat dissipation performance of metal substrates, increased temperature of electronic components, and low thermal conductivity of insulating layers. The effect of realizing thermoelectric separation, improving economic efficiency and low cost

Inactive Publication Date: 2012-10-31
苏州科医世凯半导体技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the electronics industry, usually high-power communication circuit boards or high-power LED light sources will generate a lot of heat under normal operation. If the heat is not discharged to the environment in time, it will cause the temperature of electronic components to rise and affect its Works fine, sometimes breaks
[0003] At present, in order to achieve a good heat dissipation effect, the substrates usually used are ceramic substrates or metal substrates. When the metal substrate is in use, an insulating layer must be provided between it and the circuit board to ensure the isolation of the circuit. The thermal conductivity is low, which leads to the decline of the heat dissipation performance of the entire metal substrate; however, the ceramic substrate has a better heat dissipation effect, but the cost is high, and thermal and electrical separation cannot be achieved

Method used

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  • Composite substrate for high-power component
  • Composite substrate for high-power component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as figure 1 As shown, a substrate for composite high-power components includes a metal substrate 1 and a ceramic substrate 2, a first cavity 5 is opened on the metal substrate 1, and the ceramic substrate 2 is installed in the first cavity. In the body 5, the ceramic substrate 2 is matched with the first cavity 5, and a high-power component 6 is installed on the ceramic substrate 2, and the high-power component 6 is directly connected by a metal connection line and a metal substrate circuit connection, the current does not pass through the bottom of the ceramic substrate.

[0023] A second cavity (not shown) is opened on the ceramic substrate 2, and the high-power components 6 are installed in the second cavity.

[0024] Its working principle is: install the ceramic substrate 2 with high-power components 6 in the first cavity 5 on the metal substrate 1, when the high-power components 6 work, the ceramic substrate 2 will A large amount of heat generated by the com...

Embodiment 2

[0029] Such as figure 2 As shown, the rest is the same as the above embodiment, the difference is that the upper end surface of the metal substrate 1 is provided with an insulating layer 3, and the insulating layer 3 is provided with a terminal 4 for connecting lead wires.

[0030] By adopting the technical scheme of this embodiment, the substrate for composite high-power components can also achieve the purpose of better thermal conductivity and lower cost. The terminal 4 is arranged on the top of the ceramic substrate 2, and the high-power components 6 are electrically connected to the terminal 4 on the insulating layer 3 from the top of the ceramic substrate 2, and the heat generated is dissipated from the bottom of the ceramic substrate 2, and the generated heat is reconducted. On the metal substrate 1, heat is further dissipated, thereby realizing thermoelectric separation.

[0031] Through the above technical solution, the beneficial effect of the technical solution of ...

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Abstract

The invention discloses a composite substrate for a high-power component. The composite substrate comprises a metal substrate and a ceramic substrate. A first cavity is reserved on the metal substrate. The ceramic substrate is fitted into the first cavity. The high-power component is fitted on the ceramic substrate. The high-power component is directly connected with a circuit of the metal substrate through a metal wire so that current does not pass the bottom of the ceramic substrate. The composite substrate for the high-power component is fine in effect and low in cost, and electricity and heat are separated. The ceramic substrate with the high-power component is fitted on the metal substrate. When the high-power component operates, heat generated is transferred by the ceramic substrate to the metal substrate. Under identical heat transfer efficiency, the ceramic substrate is smaller in size and lower in cost, so that economic benefit is improved to a certain extent.

Description

technical field [0001] The invention relates to a metal substrate, in particular to a substrate for composite high-power components. Background technique [0002] In the electronics industry, usually high-power communication circuit boards or high-power LED light sources will generate a lot of heat under normal operation. If the heat is not discharged to the environment in time, it will cause the temperature of electronic components to rise and affect its Works fine, sometimes breaks. [0003] At present, in order to achieve a good heat dissipation effect, the substrates usually used are ceramic substrates or metal substrates. When the metal substrate is in use, an insulating layer must be provided between it and the circuit board to ensure the isolation of the circuit. The thermal conductivity is low, which leads to a decrease in the heat dissipation performance of the entire metal substrate; however, the use of a ceramic substrate has a better heat dissipation effect, but...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/373H01L23/367
CPCH01L2924/0002
Inventor 熊大曦李蕊
Owner 苏州科医世凯半导体技术有限责任公司